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NTD20N06/D PDF预览

NTD20N06/D

更新时间: 2024-11-17 23:54:43
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Power MOSFET 20 Amps, 60 Volts

NTD20N06/D 数据手册

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NTD20N06  
Advance Information  
Power MOSFET  
20 Amps, 60 Volts  
N–Channel DPAK  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
http://onsemi.com  
20 AMPERES  
60 VOLTS  
Features  
Lower R  
Lower V  
Lower Capacitances  
Lower Total Gate Charge  
Lower and Tighter V  
DS(on)  
DS(on)  
R
= 46 m  
DS(on)  
N–Channel  
D
SD  
Lower Diode Reverse Recovery Time  
Lower Reverse Recovery Stored Charge  
Typical Applications  
G
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
4
S
4
2
3
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
1
J
1
2
3
Rating  
Symbol Value Unit  
CASE 369A  
DPAK  
(Bent Lead)  
STYLE 2  
CASE 369  
DPAK  
(Straight Lead)  
STYLE 2  
Drain–to–Source Voltage  
V
60  
60  
Vdc  
Vdc  
Vdc  
DSS  
DGR  
Drain–to–Gate Voltage (R  
= 10 M)  
V
GS  
Gate–to–Source Voltage  
– Continuous  
V
V
"20  
"30  
GS  
GS  
NTD20N06  
= Device Code  
= Year  
= Work Week  
– Non–repetitive (t v10 ms)  
p
Y
Drain Current  
– Continuous @ T = 25°C  
Adc  
Apk  
WW  
I
I
20  
10  
60  
A
D
D
– Continuous @ T = 100°C  
A
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
– Single Pulse (t v10 µs)  
I
p
DM  
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
Total Power Dissipation @ T = 25°C (Note 1.)  
Total Power Dissipation @ T = 25°C (Note 2.)  
P
60  
W
W/°C  
W
A
D
4
0.40  
1.88  
1.36  
Drain  
A
A
4
W
YWW  
NTD  
20N06  
Drain  
Operating and Storage Temperature Range  
Single Pulse Drain–to–Source Avalanche  
T , T  
J stg  
–55 to  
175  
°C  
YWW  
NTD  
20N06  
E
170  
mJ  
AS  
Energy – Starting T = 25°C  
J
GS  
(V  
= 25 Vdc, V  
= 10 Vdc,  
DD  
L = 1.0 mH, I (pk) = 18.4 A, V  
L
= 60 Vdc)  
DS  
1
2
3
1
Gate  
3
Thermal Resistance  
– Junction–to–Case  
– Junction–to–Ambient (Note 1.)  
– Junction–to–Ambient (Note 2.)  
°C/W  
°C  
Gate Drain Source  
Source  
R
R
R
2.5  
80  
110  
θJC  
θJA  
θJA  
2
Drain  
ORDERING INFORMATION  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10 seconds  
T
L
260  
Device  
Package  
Shipping  
75 Units/Rail  
1. When surface mounted to an FR4 board using 1pad size,  
NTD20N06  
DPAK  
2
(Cu Area 1.127 in ).  
DPAK  
Straight Lead  
2. When surface mounted to an FR4 board using the minimum recommended  
pad size, (Cu Area 0.412 in ).  
This document contains information on a new product. Specifications and information  
NTD20N06–1  
NTD20N06T4  
75 Units/Rail  
2
DPAK  
2500 Tape & Reel  
herein are subject to change without notice.  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
March, 2001 – Rev. 3  
NTD20N06/D  

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