NTD20N06
Advance Information
Power MOSFET
20 Amps, 60 Volts
N–Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
http://onsemi.com
20 AMPERES
60 VOLTS
Features
• Lower R
• Lower V
• Lower Capacitances
• Lower Total Gate Charge
• Lower and Tighter V
DS(on)
DS(on)
R
= 46 mΩ
DS(on)
N–Channel
D
SD
• Lower Diode Reverse Recovery Time
• Lower Reverse Recovery Stored Charge
Typical Applications
G
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
4
S
4
2
3
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
1
J
1
2
3
Rating
Symbol Value Unit
CASE 369A
DPAK
(Bent Lead)
STYLE 2
CASE 369
DPAK
(Straight Lead)
STYLE 2
Drain–to–Source Voltage
V
60
60
Vdc
Vdc
Vdc
DSS
DGR
Drain–to–Gate Voltage (R
= 10 MΩ)
V
GS
Gate–to–Source Voltage
– Continuous
V
V
"20
"30
GS
GS
NTD20N06
= Device Code
= Year
= Work Week
– Non–repetitive (t v10 ms)
p
Y
Drain Current
– Continuous @ T = 25°C
Adc
Apk
WW
I
I
20
10
60
A
D
D
– Continuous @ T = 100°C
A
MARKING DIAGRAMS
& PIN ASSIGNMENTS
– Single Pulse (t v10 µs)
I
p
DM
Total Power Dissipation @ T = 25°C
Derate above 25°C
Total Power Dissipation @ T = 25°C (Note 1.)
Total Power Dissipation @ T = 25°C (Note 2.)
P
60
W
W/°C
W
A
D
4
0.40
1.88
1.36
Drain
A
A
4
W
YWW
NTD
20N06
Drain
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche
T , T
J stg
–55 to
175
°C
YWW
NTD
20N06
E
170
mJ
AS
Energy – Starting T = 25°C
J
GS
(V
= 25 Vdc, V
= 10 Vdc,
DD
L = 1.0 mH, I (pk) = 18.4 A, V
L
= 60 Vdc)
DS
1
2
3
1
Gate
3
Thermal Resistance
– Junction–to–Case
– Junction–to–Ambient (Note 1.)
– Junction–to–Ambient (Note 2.)
°C/W
°C
Gate Drain Source
Source
R
R
R
2.5
80
110
θJC
θJA
θJA
2
Drain
ORDERING INFORMATION
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T
L
260
Device
Package
Shipping
75 Units/Rail
1. When surface mounted to an FR4 board using 1″ pad size,
NTD20N06
DPAK
2
(Cu Area 1.127 in ).
DPAK
Straight Lead
2. When surface mounted to an FR4 board using the minimum recommended
pad size, (Cu Area 0.412 in ).
This document contains information on a new product. Specifications and information
NTD20N06–1
NTD20N06T4
75 Units/Rail
2
DPAK
2500 Tape & Reel
herein are subject to change without notice.
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
March, 2001 – Rev. 3
NTD20N06/D