NTD20N06L, NTDV20N06L
Power MOSFET
20 Amps, 60 Volts
Logic Level, N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
http://onsemi.com
V
R
DS(on)
TYP
I MAX
D
(BR)DSS
Features
20 A
(Note 1)
60 V
39 mW@5.0 V
• AEC Q101 Qualified − NTDV20N06L
• These Devices are Pb−Free and are RoHS Compliant
N−Channel
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
D
G
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
S
Rating
Symbol Value
Unit
Vdc
Vdc
Vdc
MARKING DIAGRAMS
& PIN ASSIGNMENTS
Drain−to−Source Voltage
V
60
60
DSS
DGR
Drain−to−Gate Voltage (R = 10 MW)
V
GS
Gate−to−Source Voltage
− Continuous
4
V
V
"15
"20
Drain
GS
GS
− Non−repetitive (t v10 ms)
p
4
DPAK
Drain Current
CASE 369C
(Surface Mount)
STYLE 2
− Continuous @ T = 25°C
I
I
20
10
60
Adc
Apk
A
D
D
2
− Continuous @ T = 100°C
1
A
− Single Pulse (t v10 ms)
3
p
I
DM
2
1
Gate
3
Total Power Dissipation @ T = 25°C
P
D
60
W
W/°C
W
A
Drain
Derate above 25°C
Source
0.40
1.88
1.36
Total Power Dissipation @ T = 25°C (Note 1)
A
Total Power Dissipation @ T = 25°C (Note 2)
A
W
4
Operating and Storage Temperature Range
T , T
−55 to
+175
°C
Drain
J
stg
4
DPAK
CASE 369D
(Straight Lead)
STYLE 2
Single Pulse Drain−to−Source Avalanche
E
128
mJ
AS
Energy − Starting T = 25°C
J
(V = 25 Vdc, V = 5.0 Vdc,
DD
GS
L = 1.0 mH, I (pk) = 16 A, V = 60 Vdc)
L
DS
1
2
3
Thermal Resistance
°C/W
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R
R
R
2.5
80
110
q
JC
JA
JA
1
2
3
q
q
Gate Drain Source
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
T
260
°C
L
Y
= Year
= Work Week
= Device Code
= Pb−Free Package
WW
20N6L
G
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
1. When surface mounted to an FR4 board using 1 in pad size, (Cu Area 1.127 in ).
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
2. When surface mounted to an FR4 board using recommended pad size,
2
(Cu Area 0.412 in ).
©
Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
October, 2011 − Rev. 3
NTD20N06L/D