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NTD20N06L-1 PDF预览

NTD20N06L-1

更新时间: 2024-11-17 21:54:23
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
12页 93K
描述
Power MOSFET 20 Amps, 60 Volts, Logic Level

NTD20N06L-1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.28雪崩能效等级(Eas):128 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):20 A
最大漏极电流 (ID):20 A最大漏源导通电阻:0.048 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):1.36 W最大脉冲漏极电流 (IDM):60 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTD20N06L-1 数据手册

 浏览型号NTD20N06L-1的Datasheet PDF文件第2页浏览型号NTD20N06L-1的Datasheet PDF文件第3页浏览型号NTD20N06L-1的Datasheet PDF文件第4页浏览型号NTD20N06L-1的Datasheet PDF文件第5页浏览型号NTD20N06L-1的Datasheet PDF文件第6页浏览型号NTD20N06L-1的Datasheet PDF文件第7页 
NTD20N06L  
Power MOSFET  
20 Amps, 60 Volts, Logic Level  
N−Channel DPAK  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
http://onsemi.com  
Typical Applications  
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
20 A  
(Note 1)  
60 V  
39 mW@5.0 V  
N−Channel  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
D
Rating  
Symbol Value Unit  
Drain−to−Source Voltage  
V
60  
60  
Vdc  
Vdc  
Vdc  
DSS  
Drain−to−Gate Voltage (R = 10 M)  
V
DGR  
GS  
G
Gate−to−Source Voltage  
− Continuous  
V
V
"15  
"20  
GS  
GS  
− Non−repetitive (t v10 ms)  
p
S
Drain Current  
− Continuous @ T = 25°C  
I
20  
10  
60  
Adc  
Apk  
A
D
MARKING DIAGRAMS  
− Continuous @ T = 100°C  
I
D
A
4
− Single Pulse (t v10 µs)  
I
DM  
p
4
Drain  
Total Power Dissipation @ T = 25°C  
P
60  
W
W/°C  
W
A
D
Derate above 25°C  
0.40  
1.88  
1.36  
2
1
Total Power Dissipation @ T = 25°C (Note 1.)  
A
3
Total Power Dissipation @ T = 25°C (Note 2.)  
W
A
DPAK  
Operating and Storage Temperature Range  
T , T  
55 to  
+175  
°C  
J
stg  
CASE 369C  
2
Style 2  
1
3
Single Pulse Drain−to−Source Avalanche  
E
AS  
128  
mJ  
Drain  
Gate  
Source  
4
Energy − Starting T = 25°C  
J
4
(V = 25 Vdc, V = 5.0 Vdc,  
DD  
GS  
Drain  
L = 1.0 mH, I (pk) = 16 A, V = 60 Vdc)  
L
DS  
Thermal Resistance  
− Junction−to−Case  
− Junction−to−Ambient (Note 1.)  
− Junction−to−Ambient (Note 2.)  
°C/W  
°C  
R
R
R
2.5  
80  
110  
θ
JC  
JA  
JA  
1
2
3
θ
θ
DPAK  
CASE 369D  
Style 2  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10 seconds  
T
260  
L
1. When surface mounted to an FR4 board using 1pad size,  
1
2
3
20N06L  
Y
WW  
Device Code  
= Year  
= Work Week  
2
(Cu Area 1.127 in ).  
Gate Drain Source  
2. When surface mounted to an FR4 board using recommended pad size,  
2
(Cu Area 0.412 in ).  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NTD20N06L  
DPAK  
75 Units/Rail  
75 Units/Rail  
DPAK  
Straight Lead  
NTD20N06L−1  
NTD20N06LT4  
DPAK  
2500 Tape & Reel  
Semiconductor Components Industries, LLC, 2003  
1
Publication Order Number:  
August, 2003 − Rev. 1  
NTD20N06L/D  

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