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NTD20N06L-1G PDF预览

NTD20N06L-1G

更新时间: 2024-11-02 12:01:59
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 128K
描述
Power MOSFET 20 Amps, 60 Volts Logic Level, N−Channel DPAK

NTD20N06L-1G 技术参数

是否无铅: 不含铅生命周期:End Of Life
包装说明:DPAK-3针数:4
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.61雪崩能效等级(Eas):128 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):20 A
最大漏极电流 (ID):20 A最大漏源导通电阻:0.048 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):60 W
最大脉冲漏极电流 (IDM):60 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTD20N06L-1G 数据手册

 浏览型号NTD20N06L-1G的Datasheet PDF文件第2页浏览型号NTD20N06L-1G的Datasheet PDF文件第3页浏览型号NTD20N06L-1G的Datasheet PDF文件第4页浏览型号NTD20N06L-1G的Datasheet PDF文件第5页浏览型号NTD20N06L-1G的Datasheet PDF文件第6页浏览型号NTD20N06L-1G的Datasheet PDF文件第7页 
NTD20N06L, NTDV20N06L  
Power MOSFET  
20 Amps, 60 Volts  
Logic Level, NChannel DPAK  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
http://onsemi.com  
V
R
DS(on)  
TYP  
I MAX  
D
(BR)DSS  
Features  
20 A  
(Note 1)  
60 V  
39 mW@5.0 V  
AEC Q101 Qualified NTDV20N06L  
These Devices are PbFree and are RoHS Compliant  
NChannel  
Typical Applications  
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
D
G
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
S
Rating  
Symbol Value  
Unit  
Vdc  
Vdc  
Vdc  
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
DraintoSource Voltage  
V
60  
60  
DSS  
DGR  
DraintoGate Voltage (R = 10 MW)  
V
GS  
GatetoSource Voltage  
Continuous  
4
V
V
"15  
"20  
Drain  
GS  
GS  
Nonrepetitive (t v10 ms)  
p
4
DPAK  
Drain Current  
CASE 369C  
(Surface Mount)  
STYLE 2  
Continuous @ T = 25°C  
I
I
20  
10  
60  
Adc  
Apk  
A
D
D
2
Continuous @ T = 100°C  
1
A
Single Pulse (t v10 ms)  
3
p
I
DM  
2
1
Gate  
3
Total Power Dissipation @ T = 25°C  
P
D
60  
W
W/°C  
W
A
Drain  
Derate above 25°C  
Source  
0.40  
1.88  
1.36  
Total Power Dissipation @ T = 25°C (Note 1)  
A
Total Power Dissipation @ T = 25°C (Note 2)  
A
W
4
Operating and Storage Temperature Range  
T , T  
55 to  
+175  
°C  
Drain  
J
stg  
4
DPAK  
CASE 369D  
(Straight Lead)  
STYLE 2  
Single Pulse DraintoSource Avalanche  
E
128  
mJ  
AS  
Energy Starting T = 25°C  
J
(V = 25 Vdc, V = 5.0 Vdc,  
DD  
GS  
L = 1.0 mH, I (pk) = 16 A, V = 60 Vdc)  
L
DS  
1
2
3
Thermal Resistance  
°C/W  
JunctiontoCase  
JunctiontoAmbient (Note 1)  
JunctiontoAmbient (Note 2)  
R
R
R
2.5  
80  
110  
q
JC  
JA  
JA  
1
2
3
q
q
Gate Drain Source  
Maximum Lead Temperature for Soldering  
Purposes, 1/8 in from case for 10 seconds  
T
260  
°C  
L
Y
= Year  
= Work Week  
= Device Code  
= PbFree Package  
WW  
20N6L  
G
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
2
1. When surface mounted to an FR4 board using 1 in pad size, (Cu Area 1.127 in ).  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
2. When surface mounted to an FR4 board using recommended pad size,  
2
(Cu Area 0.412 in ).  
©
Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
October, 2011 Rev. 3  
NTD20N06L/D  
 

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