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NTD23N03RG PDF预览

NTD23N03RG

更新时间: 2024-01-02 03:44:33
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 67K
描述
23 Amps, 25 Volts, N−Channel DPAK

NTD23N03RG 数据手册

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NTD23N03R  
Power MOSFET  
23 Amps, 25 Volts, N−Channel DPAK  
Features  
http://onsemi.com  
Pb−Free Packages are Available  
Planar HD3e Process for Fast Switching Performance  
V
R
TYP  
I MAX  
D
Low R  
to Minimize Conduction Loss  
(BR)DSS  
DS(on)  
DS(on)  
Low C to Minimize Driver Loss  
25 V  
32 mW  
23 A  
iss  
Low Gate Charge  
Optimized for High Side Switching Requirements in  
N−CHANNEL  
D
High−Efficiency DC−DC Converters  
MAXIMUM RATINGS (T = 25°C unless otherwise specified)  
J
G
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
25  
Unit  
Vdc  
Vdc  
V
DSS  
S
Gate−to−Source Voltage − Continuous  
V
GS  
±20  
MARKING  
DIAGRAMS  
Thermal Resistance, Junction−to−Case  
R
P
5.6  
22.3  
°C/W  
W
q
JC  
Total Power Dissipation @ T = 25°C  
C
D
Drain Current  
4
− Continuous @ T = 25°C, Chip  
− Continuous @ T = 25°C,  
I
I
23  
17.1  
A
A
C
D
Drain  
C
D
Limited by Package  
− Single Pulse  
4
DPAK  
CASE 369AA  
(Surface Mounted)  
STYLE 2  
I
40  
76  
A
DM  
Thermal Resistance, Junction−to−Ambient  
(Note 1)  
R
°C/W  
q
JA  
2
1
3
Total Power Dissipation @ T = 25°C  
Drain Current − Continuous @ T = 25°C  
P
1.64  
4.5  
W
A
A
D
I
A
D
2
1
Gate  
3
Drain  
Thermal Resistance, Junction−to−Ambient  
(Note 2)  
R
110  
°C/W  
q
JA  
Source  
Total Power Dissipation @ T = 25°C  
P
I
1.14  
3.8  
W
A
A
D
4
Drain Current − Continuous @ T = 25°C  
A
D
Drain  
Operating and Storage Temperature Range  
T , T  
−55 to  
150  
°C  
J
stg  
4
DPAK−3  
CASE 369D  
(Straight Lead)  
STYLE 2  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10 seconds  
T
L
260  
°C  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
1
2
3
1
2
3
Gate Drain Source  
1. When surface mounted to an FR4 board using 0.5 sq in pad size.  
2. When surface mounted to an FR4 board using minimum recommended pad  
size.  
T23N03  
A
Y
= Device Code  
= Assembly Location  
= Year  
WW  
= Work Week  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
August, 2004 − Rev. 4  
NTD23N03R/D  
 

NTD23N03RG 替代型号

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