NTD23N03R
Power MOSFET
23 Amps, 25 Volts, N−Channel DPAK
Features
http://onsemi.com
• Pb−Free Packages are Available
• Planar HD3e Process for Fast Switching Performance
V
R
TYP
I MAX
D
• Low R
to Minimize Conduction Loss
(BR)DSS
DS(on)
DS(on)
• Low C to Minimize Driver Loss
25 V
32 mW
23 A
iss
• Low Gate Charge
• Optimized for High Side Switching Requirements in
N−CHANNEL
D
High−Efficiency DC−DC Converters
MAXIMUM RATINGS (T = 25°C unless otherwise specified)
J
G
Parameter
Drain−to−Source Voltage
Symbol
Value
25
Unit
Vdc
Vdc
V
DSS
S
Gate−to−Source Voltage − Continuous
V
GS
±20
MARKING
DIAGRAMS
Thermal Resistance, Junction−to−Case
R
P
5.6
22.3
°C/W
W
q
JC
Total Power Dissipation @ T = 25°C
C
D
Drain Current
4
− Continuous @ T = 25°C, Chip
− Continuous @ T = 25°C,
I
I
23
17.1
A
A
C
D
Drain
C
D
Limited by Package
− Single Pulse
4
DPAK
CASE 369AA
(Surface Mounted)
STYLE 2
I
40
76
A
DM
Thermal Resistance, Junction−to−Ambient
(Note 1)
R
°C/W
q
JA
2
1
3
Total Power Dissipation @ T = 25°C
Drain Current − Continuous @ T = 25°C
P
1.64
4.5
W
A
A
D
I
A
D
2
1
Gate
3
Drain
Thermal Resistance, Junction−to−Ambient
(Note 2)
R
110
°C/W
q
JA
Source
Total Power Dissipation @ T = 25°C
P
I
1.14
3.8
W
A
A
D
4
Drain Current − Continuous @ T = 25°C
A
D
Drain
Operating and Storage Temperature Range
T , T
−55 to
150
°C
J
stg
4
DPAK−3
CASE 369D
(Straight Lead)
STYLE 2
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T
L
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1
2
3
1
2
3
Gate Drain Source
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using minimum recommended pad
size.
T23N03
A
Y
= Device Code
= Assembly Location
= Year
WW
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
August, 2004 − Rev. 4
NTD23N03R/D