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NTD20P06LG PDF预览

NTD20P06LG

更新时间: 2024-11-01 22:40:27
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 76K
描述
Power MOSFET −60 V, −15.5 A, Single P−Channel, DPAK

NTD20P06LG 技术参数

是否无铅:不含铅生命周期:End Of Life
包装说明:DPAK-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.13Is Samacsys:N
雪崩能效等级(Eas):304 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):15 A最大漏极电流 (ID):15.5 A
最大漏源导通电阻:0.15 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):54 W
最大脉冲漏极电流 (IDM):50 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTD20P06LG 数据手册

 浏览型号NTD20P06LG的Datasheet PDF文件第2页浏览型号NTD20P06LG的Datasheet PDF文件第3页浏览型号NTD20P06LG的Datasheet PDF文件第4页浏览型号NTD20P06LG的Datasheet PDF文件第5页浏览型号NTD20P06LG的Datasheet PDF文件第6页浏览型号NTD20P06LG的Datasheet PDF文件第7页 
NTD20P06L  
Power MOSFET  
−60 V, 15.5 A, Single P−Channel, DPAK  
Features  
Withstands High Energy in Avalanche and Commutation Modes  
Low Gate Charge for Fast Switching  
Pb−Free Packages are Available  
http://onsemi.com  
I
D
MAX  
(Note 1)  
V
R
TYP  
DS(on)  
Applications  
(BR)DSS  
Bridge Circuits  
−60 V  
130 mW @ −5.0 V  
−15.5 A  
Power Supplies, Power Motor Controls  
DC−DC Conversion  
P−Channel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
Drain−to−Source Voltage  
Symbol Value  
Unit  
V
V
DSS  
−60  
$20  
$30  
−15.5  
G
Gate−to−Source  
Voltage  
Continuous  
V
GS  
V
S
Non−Repetitive  
Steady State  
t
v10 ms  
V
GSM  
p
Continuous  
Drain Current  
(Note 1)  
T = 25°C  
I
D
A
A
MARKING DIAGRAMS  
4
4
Drain  
Power Dissipa-  
tion (Note 1)  
Steady State  
T = 25°C  
P
65  
W
A
A
D
2
1
3
Pulsed Drain  
Current  
t = 10 ms  
p
I
$50  
DM  
DPAK  
CASE 369C  
Style 2  
Operating Junction and Storage Temperature  
T ,  
−55 to  
175  
°C  
mJ  
J
2
T
STG  
1
Gate  
3
Drain  
Source  
4
Single Pulse Drain−to−Source Avalanche  
Energy (V = 25 V, V = 5 V, I = 15 A,  
E
AS  
304  
4
DD  
GS  
PK  
L = 2.7 mH, R = 25 W)  
G
Drain  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
260  
°C  
L
1
2
3
THERMAL RESISTANCE RATINGS  
Parameter  
DPAK  
CASE 369D  
Style 2  
Symbol  
Max  
2.3  
80  
Unit  
Junction−to−Case (Drain)  
R
°C/W  
q
JC  
q
JA  
q
JA  
Junction−to−Ambient – Steady State (Note 1)  
Junction−to−Ambient – Steady State (Note 2)  
R
R
1
2
3
20P06L  
Y
Device Code  
= Year  
Gate Drain Source  
110  
WW  
= Work Week  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
1. Surface−mounted on FR4 board using 1 in sq. pad size  
(Cu area = 1.127 in sq. [1 oz] including traces)  
2. Surface−mounted on FR4 board using the minimum recommended pad size  
(Cu area = 0.412 in sq.)  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
August, 2004 − Rev. 3  
NTD20P06L/D  
 

NTD20P06LG 替代型号

型号 品牌 替代类型 描述 数据表
NTD20P06L-1G ONSEMI

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