NSBC114EPDXV6T1G,
NSVBC114EPDXV6T1G Series
Dual Bias Resistor
Transistors
NPN and PNP Silicon Surface Mount
Transistors with Monolithic Bias
Resistor Network
http://onsemi.com
The BRT (Bias Resistor Transistor) contains a single transistor with
a monolithic bias network consisting of two resistors; a series base
resistor and a base−emitter resistor. These digital transistors are
designed to replace a single device and its external resistor bias
network. The BRT eliminates these individual components by
integrating them into a single device. In the NSBC114EPDXV6T1
series, two complementary BRT devices are housed in the SOT−563
package which is ideal for low power surface mount applications
where board space is at a premium.
SOT−563
CASE 463A
PLASTIC
(3)
(2)
(1)
R
1
R
2
Q
1
Q
Features
2
R
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• Available in 8 mm, 7 inch Tape and Reel
• AEC−Q101 Qualified and PPAP Capable
2
R
1
(4)
(5)
(6)
MARKING DIAGRAM
• NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
• These are Pb−Free Devices*
xx MG
G
xx = Specific Device Code
(see table on page 2)
MAXIMUM RATINGS (T = 25°C unless otherwise noted, common for Q
A
1
M
G
= Date Code
= Pb−Free Package
and Q , − minus sign for Q (PNP) omitted)
2
1
Rating
Symbol
Value
50
Unit
Vdc
(Note: Microdot may be in either location)
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current
V
CBO
CEO
ORDERING INFORMATION
V
50
Vdc
†
Device
Package
Shipping
I
C
100
mAdc
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
NSBC114EPDXV6T1G SOT−563
4 mm pitch
4000/Tape & Reel
NSBC114EPDXV6T5G SOT−563
2 mm pitch
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking table
on page 2 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
January, 2012 − Rev. 7
NSBC114EPDXV6/D