DATA SHEET
www.onsemi.com
Low VCE(sat) NPN Transistors
20 V, 2 A
20 Volt, 2 Amp
NPN Low V Transistors
CE(sat)
MARKING
DIAGRAM
NSS20201DMT
2
onsemi’s e PowerEdge family of low V
transistors are
CE(sat)
1
2
3
6
5
4
WDFN6
CASE 506AN
miniature surface mount devices featuring ultra low saturation voltage
XX MG
G
(V ) and high current gain capability. These are designed for use
CE(sat)
1
in low voltage, high speed switching applications where affordable
efficient energy control is important.
XX = Specific Device Code
M
= Date Code
Typical applications are DC−DC converters and LED lightning,
power management…etc. In the automotive industry they can be used
in air bag deployment and in the instrument cluster. The high current
G
= Pb−Free Package
(Note: Microdot may be in either location)
2
gain allows e PowerEdge devices to be driven directly from PMU’s
control outputs, and the Linear Gain (Beta) makes them ideal
components in analog amplifiers.
PIN CONNECTIONS
6
5
4
1
2
3
Features
7
8
• NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• NSV20201DMTWTBG − Wettable Flanks Device
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
6,7
5
1
2
MAXIMUM RATINGS (T = 25°C)
A
Rating
Collector−Emitter Voltage
Symbol
Max
20
20
7
Unit
Vdc
Vdc
Vdc
A
V
CEO
V
CBO
V
EBO
Collector−Base Voltage
Emitter−Base Voltage
4
3,8
Collector Current − Continuous
Collector Current − Peak
I
C
2
ORDERING INFORMATION
I
3
A
CM
†
Device
Package
Shipping
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
NSS20201DMTTBG
WDFN6
(Pb−Free)
3000 / Tape &
Reel
NSV20201DMTWTBG
WDFN6
(Pb−Free)
3000 / Tape &
Reel
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Thermal Resistance Junction−to−Ambient
R
55
°C/W
q
JA
(Notes 1 and 2)
Total Power Dissipation per Package @
T = 25°C (Note 2)
A
P
2.27
69
W
°C/W
W
D
Thermal Resistance Junction−to−Ambient
(Note 3)
R
q
JA
Power Dissipation per Transistor @ T = 25°C
P
1.8
A
D
(Note 3)
Junction and Storage Temperature Range
T , T
−55 to
+150
°C
J
stg
2
1. Per JESD51−7 with 100 mm pad area and 2 oz. Cu (Dual Operation).
2. P per Transistor when both are turned on is one half of Total P or 1.13 Watts.
D
D
2
3. Per JESD51−7 with 100 mm pad area and 2 oz. Cu (Single−Operation).
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
January, 2022 − Rev. 1
NSS20201DMT/D