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NSS35200CF8T1G PDF预览

NSS35200CF8T1G

更新时间: 2024-11-03 22:28:47
品牌 Logo 应用领域
安森美 - ONSEMI 晶体开关晶体管便携式
页数 文件大小 规格书
6页 70K
描述
High Current Surface Mount PNP Silicon Low VCE-SAT Switching Transistor for Load Management in Portable Applications

NSS35200CF8T1G 数据手册

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NSS35200CF8T1G  
High Current Surface Mount  
PNP Silicon Low VCE−SAT  
Switching Transistor for  
Load Management in  
Portable Applications  
This is a Pb−Free Device  
http://onsemi.com  
35 VOLTS  
2.0 AMPS  
MAXIMUM RATINGS (T = 25°C)  
A
PNP TRANSISTOR  
Rating  
Symbol  
Max  
−35  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
A
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
V
CEO  
V
CBO  
V
EBO  
COLLECTOR  
1, 2, 3, 6, 7, 8  
−55  
−5.0  
−2.0  
−7.0  
4
Collector Current − Continuous  
Collector Current − Peak  
Electrostatic Discharge  
I
C
BASE  
I
CM  
ESD  
HBM Class 3  
MM Class C  
5
EMITTER  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
ChipFET]  
CASE 1206A  
STYLE 4  
Total Device Dissipation  
T = 25°C  
A
P
(Note 1)  
635  
mW  
D
Derate above 25°C  
5.1  
mW/°C  
°C/W  
Thermal Resistance,  
Junction−to−Ambient  
R
(Note 1)  
200  
q
JA  
PIN  
MARKING  
DIAGRAM  
CONNECTIONS  
Total Device Dissipation  
P
(Note 2)  
(Note 2)  
1.35  
W
D
T = 25°C  
A
8
7
6
5
1
2
3
4
C
C
C
E
C
C
C
B
1
2
3
4
8
7
6
5
Derate above 25°C  
11  
90  
mW/°C  
°C/W  
Thermal Resistance,  
Junction−to−Ambient  
R
q
JA  
Thermal Resistance,  
Junction−to−Lead #1  
R
15  
°C/W  
W
q
JL  
Total Device Dissipation  
(Single Pulse < 10 sec)  
P
2.75  
Dsingle  
(Notes 2 & 3)  
G4= Specific Device Code  
M = Month Code  
Junction and Storage  
Temperature Range  
T , T  
−55 to  
+150  
°C  
J
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
ORDERING INFORMATION  
Device  
NSS35200CF8T1G  
Package  
Shipping  
ChipFET  
(Pb−Free)  
3000/  
Tape & Reel  
2
1. FR4 @ 100 mm , 1 oz copper traces.  
2
2. FR4 @ 500 mm , 1 oz copper traces.  
3. Thermal response.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
April, 2005 − Rev. 2  
NSS35200CF8T1G/D  
 

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