NGD15N41CL,
NGD15N41ACL,
NGB15N41CL,
NGB15N41ACL,
NGP15N41CL,
NGP15N41ACL
http://onsemi.com
Ignition IGBT 15 A, 410 V
15 AMPS
410 VOLTS
N−Channel DPAK, D2PAK and TO−220
This Logic Level Insulated Gate Bipolar Transistor (IGBT) features
monolithic circuitry integrating ESD and Over−Voltage clamped
protection for use in inductive coil drivers applications. Primary uses
include Ignition, Direct Fuel Injection, or wherever high voltage and
high current switching is required.
VCE(on) 3 2.1 V @
IC = 10 A, VGE . 4.5 V
C
Features
• Ideal for Coil−on−Plug Applications
• DPAK Package Offers Smaller Footprint and Increased Board Space
• Gate−Emitter ESD Protection
R
G
G
R
GE
• Temperature Compensated Gate−Collector Voltage Clamp Limits
Stress Applied to Load
• Integrated ESD Diode Protection
• New Design Increases Unclamped Inductive Switching (UIS) Energy
Per Area
E
4
DPAK
CASE 369C
STYLE 2
• Low Threshold Voltage to Interface Power Loads to Logic or
Microprocessor Devices
2
1
3
• Low Saturation Voltage
• High Pulsed Current Capability
2
4
D PAK
• Optional Gate Resistor (R ) and Gate−Emitter Resistor (R
)
G
GE
CASE 418B
STYLE 4
• These are Pb−Free Devices
1
2
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
3
J
Rating
Collector−Emitter Voltage
Collector−Gate Voltage
Gate−Emitter Voltage
Symbol Value
Unit
4
V
V
440
440
15
V
DC
V
DC
V
DC
CES
CER
V
GE
TO−220AB
CASE 221A
STYLE 9
Collector Current−Continuous
I
C
15
50
A
DC
A
AC
@ T = 25°C − Pulsed
C
ESD (Human Body Model)
R = 1500 Ω, C = 100 pF
ESD
ESD
kV
8.0
1
2
3
ESD (Machine Model) R = 0 Ω, C = 200 pF
800
V
Total Power Dissipation @ T = 25°C
Derate above 25°C
P
107
0.71
Watts
W/°C
C
D
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
Operating and Storage Temperature Range
T , T
J
−55 to
°C
stg
+175
DEVICE MARKING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
See general marking information in the device marking
section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
December, 2011 − Rev. 8
NGD15N41CL/D