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MRF9080LR3 PDF预览

MRF9080LR3

更新时间: 2024-11-14 03:52:43
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页数 文件大小 规格书
12页 305K
描述
RF Power Field Effect Transistors(N−Channel Enhancement−Mode Lateral MOSFETs)

MRF9080LR3 数据手册

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MRF9080  
Rev. 5, 12/2004  
Freescale Semiconductor  
Technical Data  
RF Power Field Effect Transistors  
NChannel EnhancementMode Lateral MOSFETs  
Designed for GSM 900 MHz frequency band, the high gain and broadband  
performance of these devices make them ideal for largesignal, common−  
source amplifier applications in 26 volt base station equipment.  
MRF9080LR3  
MRF9080LSR3  
Typical Performance for GSM Frequencies, 921 to 960 MHz, 26 Volts  
Output Power @ P1db: 75 Watts  
Power Gain @ P1db: 18.5 dB  
GSM 900 MHz FREQUENCY BAND,  
75 W, 26 V  
Efficiency @ P1db: 55%  
Internally Matched, Controlled Q, for Ease of Use  
High Gain, High Efficiency and High Linearity  
Integrated ESD Protection  
LATERAL NCHANNEL  
RF POWER MOSFETs  
Designed for Maximum Gain and Insertion Phase Flatness  
Capable of Handling 5:1 VSWR, @ 26 Vdc, 921 MHz, 90 Watts CW  
Output Power  
Excellent Thermal Stability  
Characterized with Series Equivalent LargeSignal Impedance Parameters  
Available with Low Gold Plating Thickness on Leads. L Suffix Indicates  
40µ″ Nominal.  
In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.  
CASE 46506, STYLE 1  
NI780  
MRF9080LR3  
CASE 465A06, STYLE 1  
NI780S  
MRF9080LSR3  
Table 1. Maximum Ratings  
Rating  
Symbol  
Value  
Unit  
Vdc  
Vdc  
DrainSource Voltage  
GateSource Voltage  
V
DSS  
0.5, +65  
0.5, +15  
V
GS  
Total Device Dissipation @ T = 25°C  
P
D
250  
W
C
Derate above 25°C  
1.43  
W/°C  
Storage Temperature Range  
Operating Junction Temperature  
T
65 to +150  
°C  
°C  
stg  
T
200  
J
Table 2. Thermal Characteristics  
Characteristic  
Symbol  
Value  
Unit  
Thermal Resistance, Junction to Case  
R
0.7  
°C/W  
θ
JC  
Table 3. ESD Protection Characteristics  
Test Conditions  
Class  
Human Body Model  
Machine Model  
1 (Minimum)  
M1 (Minimum)  
NOTE CAUTION MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
© Freescale Semiconductor, Inc., 2004. All rights reserved.  

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