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MRF9080LSR3 PDF预览

MRF9080LSR3

更新时间: 2024-11-13 22:34:07
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体晶体管功率场效应晶体管射频
页数 文件大小 规格书
12页 437K
描述
RF POWER FIELD EFFECT TRANSISTORS

MRF9080LSR3 数据手册

 浏览型号MRF9080LSR3的Datasheet PDF文件第2页浏览型号MRF9080LSR3的Datasheet PDF文件第3页浏览型号MRF9080LSR3的Datasheet PDF文件第4页浏览型号MRF9080LSR3的Datasheet PDF文件第5页浏览型号MRF9080LSR3的Datasheet PDF文件第6页浏览型号MRF9080LSR3的Datasheet PDF文件第7页 
ꢒ ꢓꢎ ꢓ ꢀꢓ ꢔꢕ  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MRF9080/D  
The RF Sub–Micron MOSFET Line  
ꢀ ꢁ ꢂ ꢃꢄꢅ ꢆ ꢁꢇꢅ ꢈꢉ ꢊ ꢋꢋ ꢅ ꢌꢍ ꢎꢆ ꢏꢐ ꢑ ꢇꢑ ꢍꢃ ꢆ ꢑ  
N–Channel Enhancement–Mode Lateral MOSFETs  
Designed for GSM 900 MHz frequency band, the high gain and broadband  
performance of these devices make them ideal for large–signal, common–  
source amplifier applications in 26 volt base station equipment.  
Typical Performance for GSM Frequencies, 921 to 960 MHz, 26 Volts  
Output Power @ P1db: 75 Watts  
Power Gain @ P1db: 18.5 dB  
Efficiency @ P1db: 55%  
GSM 900 MHz FREQUENCY BAND,  
75 W, 26 V  
LATERAL N–CHANNEL  
BROADBAND RF POWER MOSFETs  
Internally Matched, Controlled Q, for Ease of Use  
High Gain, High Efficiency and High Linearity  
Integrated ESD Protection  
Designed for Maximum Gain and Insertion Phase Flatness  
Capable of Handling 5:1 VSWR, @ 26 Vdc, 921 MHz, 90 Watts CW  
Output Power  
Excellent Thermal Stability  
Characterized with Series Equivalent Large–Signal Impedance Parameters  
Available in Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.  
Available with Low Gold Plating Thickness on Leads. L Suffix Indicates  
40µ″ Nominal.  
CASE 465–06, STYLE 1  
NI–780  
MRF9080  
CASE 465A–06, STYLE 1  
NI–780S  
MRF9080SR3, MRF9080LSR3  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
–0.5, +15  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
250  
1.43  
Watts  
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
T
–65 to +200  
200  
°C  
°C  
stg  
T
J
ESD PROTECTION CHARACTERISTICS  
Test Conditions  
Class  
Human Body Model  
Machine Model  
1 (Minimum)  
M1 (Minimum)  
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
0.7  
°C/W  
θ
JC  
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 2  
Motorola, Inc. 2002  

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