Document Number: MMRF1308H
Rev. 0, 7/2014
Freescale Semiconductor
Technical Data
RF Power LDMOS Transistors
N--Channel Enhancement--Mode Lateral MOSFETs
MMRF1308HR5
MMRF1308HSR5
These high ruggedness devices are designed for use in high VSWR military,
aerospace and defense, industrial (including laser and plasma exciters),
broadcast (analog and digital), and radio/land mobile applications. They are
unmatched input and output designs allowing wide frequency range utilization,
between 1.8 and 600 MHz.
1.8--600 MHz, 600 W CW, 50 V
BROADBAND
Typical Performance: VDD = 50 Vdc, IDQ = 100 mA
RF POWER MOSFETs
P
f
G
D
IRL
out
ps
Signal Type
(W)
(MHz)
(dB)
(%)
(dB)
Pulse (100 sec,
20% Duty Cycle)
600 Peak
230
230
25.0
74.6
-- 1 8
-- 1 7
CW
600 Avg.
24.6
75.2
Capable of Handling a Load Mismatch of 65:1 VSWR @ 50 Vdc,
230 MHz, at all Phase Angles, Designed for Enhanced Ruggedness
600 W Pulse Peak Power, 20% Duty Cycle, 100 sec
NI--1230H--4S
MMRF1308HR5
Features
Unmatched Input and Output Allowing Wide Frequency Range Utilization
Device can be used Single--Ended or in a Push--Pull Configuration
Qualified Up to a Maximum of 50 VDD Operation
Characterized from 30 V to 50 V for Extended Power Range
Suitable for Linear Application with Appropriate Biasing
NI--1230S--4S
MMRF1308HSR5
Integrated ESD Protection with Greater Negative Gate--Source Voltage Range
for Improved Class C Operation
PARTS ARE PUSH--PULL
Characterized with Series Equivalent Large--Signal Impedance Parameters
In Tape and Reel. R5 Suffix = 50 Units, 56 mm Tape Width, 13--inch Reel.
Gate A
Gate B
Drain A
Drain B
3
4
1
2
Table 1. Maximum Ratings
Rating
Symbol
Value
--0.5, +133
--6.0, +10
-- 65 to +150
150
Unit
Vdc
Vdc
C
Drain--Source Voltage
Gate--Source Voltage
Storage Temperature Range
Case Operating Temperature
V
DSS
V
GS
T
stg
(Top View)
T
C
C
Note: The backside of the package is the
source terminal for the transistors.
Total Device Dissipation @ T = 25C
Derate above 25C
P
1667
8.33
W
W/C
C
D
(1,2)
Figure 1. Pin Connections
Operating Junction Temperature
T
J
225
C
Table 2. Thermal Characteristics
(2,3)
Characteristic
Symbol Value
Unit
Thermal Resistance, Junction to Case
C/W
Case Temperature 68C, 600 W Peak, 100 sec Pulse Width, 20% Duty Cycle, 100 mA, 230 MHz
Case Temperature 60C, 600 W CW, 100 mA, 230 MHz
Z
R
0.022
0.12
JC
JC
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access
MTTF calculators by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
Freescale Semiconductor, Inc., 2014. All rights reserved.
MMRF1308HR5 MMRF1308HSR5
RF Device Data
Freescale Semiconductor, Inc.
1