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MMRF1310HSR5 PDF预览

MMRF1310HSR5

更新时间: 2024-11-06 20:06:35
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
15页 570K
描述
Lateral N-Channel Broadband RF Power MOSFET, 1.8-600 MHz, 300 W, 50 V

MMRF1310HSR5 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ActiveReach Compliance Code:compliant
风险等级:5.64Base Number Matches:1

MMRF1310HSR5 数据手册

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Document Number: MMRF1310H  
Rev. 0, 7/2014  
Freescale Semiconductor  
Technical Data  
RF Power LDMOS Transistors  
N--Channel Enhancement--Mode Lateral MOSFETs  
MMRF1310HR5  
MMRF1310HSR5  
These high ruggedness devices are designed for use in high VSWR military,  
industrial (including laser and plasma exciters), broadcast (analog and digital),  
and radio/land mobile applications. They are unmatched input and output  
designs allowing wide frequency range utilization between 1.8 and 600 MHz.  
Typical Performance: VDD = 50 Vdc, IDQ = 100 mA  
P
(W)  
f
G
(dB)  
(%)  
IRL  
(dB)  
out  
1.8--600 MHz, 300 W CW, 50 V  
BROADBAND  
ps  
D
Signal Type  
(MHz)  
RF POWER MOSFETs  
Pulse (100 sec,  
300 Peak  
230  
26.5  
74.0  
-- 1 6  
20% Duty Cycle)  
CW  
300 Avg.  
130  
25.0  
80.0  
-- 1 5  
Capable of Handling a Load Mismatch of 65:1 VSWR @ 50 Vdc, 230 MHz,  
at all Phase Angles  
300 W CW Output Power  
300 W Pulse Peak Power, 20% Duty Cycle, 100 sec  
NI--780H--4L  
MMRF1310HR5  
Capable of 300 W CW Operation  
Features  
Unmatched Input and Output Allowing Wide Frequency Range Utilization  
Device can be used Single--Ended or in a Push--Pull Configuration  
Qualified Up to a Maximum of 50 VDD Operation  
Characterized from 30 V to 50 V for Extended Power Range  
Suitable for Linear Application with Appropriate Biasing  
Integrated ESD Protection  
Greater Negative Gate--Source Voltage Range for Improved Class C Operation  
Characterized with Series Equivalent Large--Signal Impedance Parameters  
NI--780H--4L in Tape and Reel. R5 Suffix = 50 Units, 56 mm Tape Width,  
13--inch Reel.  
NI--780S--4L  
MMRF1310HSR5  
NI--780S--4L in Tape and Reel. R5 Suffix = 50 Units, 32 mm Tape Width,  
13--inch Reel.  
Gate A  
Gate B  
Drain A  
Drain B  
3
4
1
2
Table 1. Maximum Ratings  
Rating  
Drain--Source Voltage  
Symbol  
Value  
--0.5, +133  
--6.0, +10  
--65 to +150  
150  
Unit  
Vdc  
Vdc  
C  
V
DSS  
Gate--Source Voltage  
V
GS  
Storage Temperature Range  
Case Operating Temperature  
T
stg  
T
C  
C
D
(Top View)  
Total Device Dissipation @ T = 25C  
P
1050  
5.26  
W
W/C  
C
Note: The backside of the package is the  
source terminal for the transistors.  
Derate above 25C  
(1,2)  
Operating Junction Temperature  
T
J
225  
C  
Figure 1. Pin Connections  
Table 2. Thermal Characteristics  
(2,3)  
Characteristic  
Symbol  
Value  
Unit  
(4)  
Thermal Resistance, Junction to Case  
C/W  
Pulse: Case Temperature 75C, 300 W Peak, 100 sec Pulse Width, 20% Duty Cycle,  
50 Vdc, I = 100 mA, 230 MHz  
CW: Case Temperature 87C, 300 W CW, 50 Vdc, I = 1100 mA, 230 MHz  
Z
R
JC  
0.05  
0.19  
DQ  
JC  
DQ  
1. Continuous use at maximum temperature will affect MTTF.  
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access  
MTTF calculators by product.  
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.  
Select Documentation/Application Notes -- AN1955.  
4. Same test circuit is used for both pulsed and CW.  
Freescale Semiconductor, Inc., 2014. All rights reserved.  

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