Document Number: MMRF1310H
Rev. 0, 7/2014
Freescale Semiconductor
Technical Data
RF Power LDMOS Transistors
N--Channel Enhancement--Mode Lateral MOSFETs
MMRF1310HR5
MMRF1310HSR5
These high ruggedness devices are designed for use in high VSWR military,
industrial (including laser and plasma exciters), broadcast (analog and digital),
and radio/land mobile applications. They are unmatched input and output
designs allowing wide frequency range utilization between 1.8 and 600 MHz.
Typical Performance: VDD = 50 Vdc, IDQ = 100 mA
P
(W)
f
G
(dB)
(%)
IRL
(dB)
out
1.8--600 MHz, 300 W CW, 50 V
BROADBAND
ps
D
Signal Type
(MHz)
RF POWER MOSFETs
Pulse (100 sec,
300 Peak
230
26.5
74.0
-- 1 6
20% Duty Cycle)
CW
300 Avg.
130
25.0
80.0
-- 1 5
Capable of Handling a Load Mismatch of 65:1 VSWR @ 50 Vdc, 230 MHz,
at all Phase Angles
300 W CW Output Power
300 W Pulse Peak Power, 20% Duty Cycle, 100 sec
NI--780H--4L
MMRF1310HR5
Capable of 300 W CW Operation
Features
Unmatched Input and Output Allowing Wide Frequency Range Utilization
Device can be used Single--Ended or in a Push--Pull Configuration
Qualified Up to a Maximum of 50 VDD Operation
Characterized from 30 V to 50 V for Extended Power Range
Suitable for Linear Application with Appropriate Biasing
Integrated ESD Protection
Greater Negative Gate--Source Voltage Range for Improved Class C Operation
Characterized with Series Equivalent Large--Signal Impedance Parameters
NI--780H--4L in Tape and Reel. R5 Suffix = 50 Units, 56 mm Tape Width,
13--inch Reel.
NI--780S--4L
MMRF1310HSR5
NI--780S--4L in Tape and Reel. R5 Suffix = 50 Units, 32 mm Tape Width,
13--inch Reel.
Gate A
Gate B
Drain A
Drain B
3
4
1
2
Table 1. Maximum Ratings
Rating
Drain--Source Voltage
Symbol
Value
--0.5, +133
--6.0, +10
--65 to +150
150
Unit
Vdc
Vdc
C
V
DSS
Gate--Source Voltage
V
GS
Storage Temperature Range
Case Operating Temperature
T
stg
T
C
C
D
(Top View)
Total Device Dissipation @ T = 25C
P
1050
5.26
W
W/C
C
Note: The backside of the package is the
source terminal for the transistors.
Derate above 25C
(1,2)
Operating Junction Temperature
T
J
225
C
Figure 1. Pin Connections
Table 2. Thermal Characteristics
(2,3)
Characteristic
Symbol
Value
Unit
(4)
Thermal Resistance, Junction to Case
C/W
Pulse: Case Temperature 75C, 300 W Peak, 100 sec Pulse Width, 20% Duty Cycle,
50 Vdc, I = 100 mA, 230 MHz
CW: Case Temperature 87C, 300 W CW, 50 Vdc, I = 1100 mA, 230 MHz
Z
R
JC
0.05
0.19
DQ
JC
DQ
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access
MTTF calculators by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
4. Same test circuit is used for both pulsed and CW.
Freescale Semiconductor, Inc., 2014. All rights reserved.
MMRF1310HR5 MMRF1310HSR5
RF Device Data
Freescale Semiconductor, Inc.
1