SPICE MODEL: MMDT5551
MMDT5551
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
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Epitaxial Planar Die Construction
SOT-363
A
Complementary PNP Type Available (MMDT5401)
Ideal for Medium Power Amplification and Switching
Ultra-Small Surface Mount Package
C2
B1
E1
Dim
A
Min
0.10
1.15
2.00
Max
0.30
1.35
2.20
C
B
B
Lead Free/RoHS Compliant (Note 3)
C
E2
B2
C1
D
0.65 Nominal
G
H
F
0.30
1.80
¾
0.40
2.20
0.10
1.00
0.40
0.25
8°
Mechanical Data
H
K
J
M
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Case: SOT-363
J
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
K
0.90
0.25
0.10
0°
L
D
F
L
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Moisture Sensitivity: Level 1 per J-STD-020C
M
Terminals: Solderable per MIL-STD-202, Method 208
C2
B1
E1
a
Lead Free Plating (Matte Tin Finish annealed
over Alloy 42 leadframe).
All Dimensions in mm
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Terminal Connections: See Diagram
Marking (See Page 2): K4N
E2
C1
B2
Ordering & Date Code Information: See Page 2
Weight: 0.006 grams (approx.)
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
VCBO
VCEO
VEBO
IC
Value
Unit
V
Collector-Base Voltage
180
160
Collector-Emitter Voltage
V
Emitter-Base Voltage
6.0
V
Collector Current - Continuous (Note 1)
Power Dissipation (Note 1, 2)
200
mA
mW
°C/W
°C
Pd
200
RqJA
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage and Temperature Range
625
Tj, TSTG
-55 to +150
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
DS30172 Rev. 7 - 2
1 of 4
MMDT5551
www.diodes.com
ã Diodes Incorporated