MJF47
High Voltage Power
Transistor
Isolated Package Applications
Designed for line operated audio output amplifiers, switching power
supply drivers and other switching applications, where the mounting
surface of the device is required to be electrically isolated from the
heatsink or chassis.
http://onsemi.com
NPN SILICON
POWER TRANSISTOR
1 AMPERE
Features
• Electrically Similar to the Popular TIP47
250 VOLTS, 28 WATTS
• 250 V
CEO(sus)
• 1 A Rated Collector Current
• No Isolating Washers Required
• Reduced System Cost
• UL Recognized, File #E69369, to 3500 V
• Pb−Free Package is Available*
Isolation
RMS
MAXIMUM RATINGS
TO−220 FULLPACK
CASE 221D
STYLE 2
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Symbol
Value
250
350
5
Unit
Vdc
Vdc
Vdc
V
1
2
3
V
CEO
V
CB
MARKING DIAGRAM
V
EB
RMS Isolation Voltage (Note 1)
V
ISOL
Test No. 1 Per Figure 10
Test No. 2 Per Figure 11
Test No. 3 Per Figure 12
4500
3500
1500
(for 1 sec, R.H. < 30%, T = 25_C)
A
Collector Current − Continuous
− Peak
I
C
1
2
Adc
Adc
MJF47G
AYWW
Base Current − Continuous
I
B
0.6
Total Power Dissipation (Note 2) @ T = 25_C
P
40
W
C
D
0.31
W/_C
Derate above 25_C
Total Power Dissipation @ T = 25_C
P
D
2.0
0.016
W
A
Derate above 25_C
W/_C
Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
T , T
J
–65 to +150
_C
stg
G
A
Y
= Pb−Free Package
= Assembly Location
= Year
Characteristic
Symbol
Max
62.5
4.4
Unit
_C/W
_C/W
_C
WW = Work Week
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case (Note 2)
Lead Temperature for Soldering Purposes
R
q
JA
R
q
JC
ORDERING INFORMATION
T
L
260
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Device
MJF47
MJF47G
Package
Shipping
TO−220 FULLPACK 50 Units/Rail
TO−220 FULLPACK 50 Units/Rail
(Pb−Free)
1. Proper strike and creepage distance must be provided.
2. Measurement made with thermocouple contacting the bottom insulated
surface (in a location beneath the die), the devices mounted on a heatsink with
thermal grease and a mounting torque of ≥ 6 in. lbs.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 5
MJF47/D