MJF6388 (NPN),
MJF6668 (PNP)
Preferred Device
Complementary Power
Darlingtons
For Isolated Package Applications
Designed for general−purpose amplifiers and switching
applications, where the mounting surface of the device is required to
be electrically isolated from the heatsink or chassis.
http://onsemi.com
COMPLEMENTARY SILICON
POWER DARLINGTONS
10 AMPERES
Features
• Isolated Overmold Package, TO−220 Type
• Electrically Similar to the Popular 2N6388, 2N6668, TIP102, and
TIP107
100 VOLTS, 40 WATTS
• 100 V
CEO(sus)
MARKING
DIAGRAM
• 10 A Rated Collector Current
• No Isolating Washers Required
• Reduced System Cost
• High DC Current Gain − 1000 (Min) @ I = 5.0 Adc
C
• High Isolation Voltage (up to 4500 VRMS)
• Case 221D is UL Recognized at 3500 VRMS: File #E69369
• Pb−Free Packages are Available*
TO−220 FULLPACK
MJF6xy8G
AYWW
1
CASE 221D
STYLE 2
UL RECOGNIZED
2
3
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Symbol
Value
100
100
5.0
Unit
Vdc
Vdc
Vdc
V
V
CEO
V
CB
V
EB
RMS Isolation Voltage (Note 1)
V
ISOL
Test No. 1 Per Figure 14
Test No. 2 Per Figure 15
Test No. 3 Per Figure 16
4500
3500
1500
MJF6xy8 = Specific Device Code
x = 3 or 6
y = 6 or 8
(for 1 sec, R.H. < 30%, T = 25_C)
A
G
A
Y
= Pb−Free Package
= Assembly Location
= Year
Collector Current − Continuous
− Peak (Note 2)
I
C
10
15
Adc
Adc
Base Current − Continuous
I
B
1.0
WW
= Work Week
Total Power Dissipation (Note 3) @ T = 25_C
P
40
W
C
D
0.31
W/_C
Derate above 25_C
Total Power Dissipation @ T = 25_C
P
D
2.0
0.016
W
A
ORDERING INFORMATION
Derate above 25_C
W/_C
Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
T , T
J
–65 to +150
_C
stg
Device
Package
Shipping
MJF6388
TO−220 FULLPACK 50 Units/Rail
Characteristic
Symbol
Max
4.0
Unit
_C/W
_C/W
_C
MJF6388G
TO−220 FULLPACK 50 Units/Rail
(Pb−Free)
Thermal Resistance, Junction−to−Case (Note 3)
Thermal Resistance, Junction−to−Ambient
Lead Temperature for Soldering Purposes
R
q
JC
R
62.5
260
q
JA
MJF6668
TO−220 FULLPACK 50 Units/Rail
T
L
MJF6668G
TO−220 FULLPACK 50 Units/Rail
(Pb−Free)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Proper strike and creepage distance must be provided.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
2. Pulse Test: Pulse Width = 5.0 ms, Duty Cycle v 10%.
3. Measurement made with thermocouple contacting the bottom insulated
surface (in a location beneath the die), the devices mounted on a heatsink with
thermal grease and a mounting torque of ≥ 6 in. lbs.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 8
MJF6388/D