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MJF47 PDF预览

MJF47

更新时间: 2024-11-02 22:05:11
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体晶体管开关局域网
页数 文件大小 规格书
6页 163K
描述
NPN SILICON POWER TRANSISTOR 1 AMPERE 250 VOLTS 28 WATTS

MJF47 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.74外壳连接:ISOLATED
最大集电极电流 (IC):1 A集电极-发射极最大电压:250 V
配置:SINGLE最小直流电流增益 (hFE):10
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e0元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:NPN
功耗环境最大值:28 W认证状态:Not Qualified
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
标称过渡频率 (fT):10 MHzVCEsat-Max:1 V
Base Number Matches:1

MJF47 数据手册

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Order this document  
by MJF47/D  
SEMICONDUCTOR TECHNICAL DATA  
NPN SILICON  
POWER TRANSISTOR  
1 AMPERE  
Isolated Package Applications  
Designed for line operated audio output amplifiers, switching power supply drivers  
and other switching applications, where the mounting surface of the device is required  
to be electrically isolated from the heatsink or chassis.  
250 VOLTS  
28 WATTS  
Electrically Similar to the Popular TIP47  
250 V  
1 A Rated Collector Current  
No Isolating Washers Required  
Reduced System Cost  
UL Recognized, File #E69369, to 3500 V  
CEO(sus)  
Isolation  
RMS  
CASE 221D–02  
TO–220 TYPE  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
250  
350  
5
Unit  
Vdc  
Vdc  
Vdc  
Collector–Emitter Voltage  
Collector–Base Voltage  
Emitter–Base Voltage  
V
CEO  
V
CB  
EB  
V
RMS Isolation Voltage (1)  
(for 1 sec, R.H. < 30%,  
Test No. 1 Per Fig. 10  
Test No. 2 Per Fig. 11  
Test No. 3 Per Fig. 12  
V
ISOL  
4500  
3500  
1500  
V
RMS  
T
= 25 C)  
A
Collector Current — Continuous  
Peak  
I
1
2
Adc  
Adc  
C
Base Current  
I
0.6  
B
Total Power Dissipation* @ T = 25 C  
C
Derate above 25 C  
P
D
28  
0.23  
Watts  
W/ C  
Total Power Dissipation @ T = 25 C  
A
Derate above 25 C  
P
D
2
Watts  
W/ C  
0.016  
Operating and Storage Junction Temperature Range  
T , T  
65 to +150  
C
J
stg  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
62.5  
4.4  
Unit  
C/W  
C/W  
C
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Case*  
Lead Temperature for Soldering Purpose  
R
R
θJA  
θJC  
T
L
260  
* Measurement made with thermocouple contacting the bottom insulated mounting surface (in a location beneath the die), the device mounted on  
a heatsink with thermal grease and a mounting torque of 6 in. lbs.  
(1) Proper strike and creepage distance must be provided.  
Motorola, Inc. 1995

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