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MJD340_11 PDF预览

MJD340_11

更新时间: 2024-11-18 10:55:51
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
5页 120K
描述
High Voltage Power Transistors

MJD340_11 数据手册

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MJD340 (NPN)  
MJD350 (PNP)  
High Voltage Power  
Transistors  
DPAK For Surface Mount Applications  
http://onsemi.com  
Designed for line operated audio output amplifier, switchmode  
power supply drivers and other switching applications.  
SILICON  
Features  
POWER TRANSISTORS  
0.5 AMPERE  
300 VOLTS, 15 WATTS  
Lead Formed for Surface Mount Applications in Plastic Sleeves  
(No Suffix)  
Electrically Similar to Popular MJE340 and MJE350  
300 V (Min) V  
CEO(sus)  
4
0.5 A Rated Collector Current  
Epoxy Meets UL 94 V0 @ 0.125 in  
2
1
ESD Ratings: Human Body Model, 3B u 8000 V  
3
Machine Model, C u 400 V  
DPAK  
CASE 369C  
STYLE 1  
These are PbFree Packages  
MAXIMUM RATINGS  
Rating  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
Symbol  
Max  
300  
300  
3
Unit  
Vdc  
Vdc  
Vdc  
Adc  
MARKING DIAGRAM  
V
CEO  
V
CB  
AYWW  
J3x0G  
V
EB  
I
C
0.5  
0.75  
Collector Current Continuous  
Peak  
A
Y
= Assembly Location  
= Year  
P
P
15  
W
Total Power Dissipation @ T = 25°C  
D
C
0.12  
W/°C  
Derate above 25°C  
WW = Work Week  
J3x0 = Device Code  
x= 4 or 5  
Total Power Dissipation (Note 1)  
D
1.56  
0.012  
W
W/°C  
@ T = 25°C  
A
G
= PbFree Package  
Derate above 25°C  
Operating and Storage Junction  
Temperature Range  
T , T  
65 to +150  
°C  
J
stg  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
8.33  
80  
Unit  
°C/W  
°C/W  
Thermal Resistance, JunctiontoCase  
R
q
JC  
Thermal Resistance, JunctiontoAmbient  
(Note 1)  
R
q
JA  
Leading Temperature for Soldering Purpose  
T
L
260  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. These ratings are applicable when surface mounted on the minimum pad  
sizes recommended.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
January, 2011 Rev. 8  
MJD340/D  
 

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