生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 153 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.B.2.A |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.84 |
其他特性: | PIPELINED ARCHITECTURE | JESD-30 代码: | R-PBGA-B153 |
长度: | 22 mm | 内存密度: | 18874368 bit |
内存集成电路类型: | DDR SRAM | 内存宽度: | 18 |
功能数量: | 1 | 端子数量: | 153 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 1MX18 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY |
并行/串行: | PARALLEL | 认证状态: | Not Qualified |
座面最大高度: | 2.21 mm | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
宽度: | 14 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K7D163671B-HC30 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX36, 1.9ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | |
K7D163671B-HC300 | SAMSUNG |
获取价格 |
DDR SRAM, 512KX36, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | |
K7D163671B-HC30T | SAMSUNG |
获取价格 |
Application Specific SRAM, 512KX36, 1.9ns, CMOS, PBGA153 | |
K7D163671B-HC33 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX36, 1.7ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | |
K7D163671B-HC33T | SAMSUNG |
获取价格 |
Application Specific SRAM, 512KX36, 1.7ns, CMOS, PBGA153 | |
K7D163671B-HC37 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX36, 1.7ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | |
K7D163671B-HC370 | SAMSUNG |
获取价格 |
DDR SRAM, 512KX36, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | |
K7D163671B-HC37T | SAMSUNG |
获取价格 |
Application Specific SRAM, 512KX36, 1.7ns, CMOS, PBGA153 | |
K7D163671B-HC40 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX36, CMOS, PBGA153 | |
K7D163671M-HC33 | SAMSUNG |
获取价格 |
DDR SRAM, 512KX36, 1.7ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, FLIP CHIP, BGA-153 |