Datasheet > K7D163688M-HC25

K7D163688M-HC25

更新时间： 2024-09-18 07:11:59

品牌	Logo	应用领域
三星 - SAMSUNG		双倍数据速率静态存储器
页数	文件大小	规格书
14页	365K
描述
DDR SRAM, 512KX36, 0.1ns, CMOS, PBGA153, 14 X 22 MM, FCBGA-153

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K7D163688M-HC25 数据手册

K7D163688M

K7D161888M

512Kx36 & 1Mx18 SRAM

Document Title

16M DDR SYNCHRONOUS SRAM

Revision History

RevNo.

History

DraftData

Remark

Rev. 0.0

Initial document.

October. 2000

Advance

Rev. 0.1

Rev. 0.2

Rev. 1.0

Add-HC37 part(Part Number, Idd, AC Characteristics)

Timing Waveform Information Changed

April. 2001

May. 2001

Sep. 2001

Advance

Final

Package thermal characteristics add.

Final specification release.

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the

right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters

of this device. If you have any questions, please contact the SAMSUNG branch office near your office, call or cortact Headquarters.

Rev 1.0

- 1 -

Sep. 2001

12 3 4 5 6 7...14

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型号	品牌	获取价格	描述	数据表
K7D163688M-HC33	SAMSUNG	获取价格	DDR SRAM, 512KX36, 0.1ns, CMOS, PBGA153, 14 X 22 MM, FCBGA-153
K7D321874A	SAMSUNG	获取价格	32Mb A-die DDR SRAM Specification
K7D321874A-GC37	SAMSUNG	获取价格	Standard SRAM, 2MX18, 2ns, CMOS, PBGA153
K7D321874A-GC40	SAMSUNG	获取价格	Standard SRAM, 2MX18, 2ns, CMOS, PBGA153
K7D321874A-GC400	SAMSUNG	获取价格	DDR SRAM, 2MX18, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-153
K7D321874A-HC33	SAMSUNG	获取价格	32Mb A-die DDR SRAM Specification
K7D321874A-HC330	SAMSUNG	获取价格	DDR SRAM, 2MX18, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
K7D321874A-HC37	SAMSUNG	获取价格	32Mb A-die DDR SRAM Specification
K7D321874A-HC370	SAMSUNG	获取价格	DDR SRAM, 2MX18, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
K7D321874A-HC40	SAMSUNG	获取价格	32Mb A-die DDR SRAM Specification