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K7D161888M-HC330 PDF预览

K7D161888M-HC330

更新时间: 2024-09-17 19:51:31
品牌 Logo 应用领域
三星 - SAMSUNG 双倍数据速率静态存储器内存集成电路
页数 文件大小 规格书
16页 168K
描述
DDR SRAM, 1MX18, CMOS, PBGA153, 14 X 22 MM, BGA-153

K7D161888M-HC330 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:BGA,针数:153
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.84
其他特性:PIPELINED ARCHITECTUREJESD-30 代码:R-PBGA-B153
长度:22 mm内存密度:18874368 bit
内存集成电路类型:DDR SRAM内存宽度:18
功能数量:1端子数量:153
字数:1048576 words字数代码:1000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1MX18
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:2.21 mm最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
宽度:14 mmBase Number Matches:1

K7D161888M-HC330 数据手册

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Advance  
K7D161888B  
1Mx18 SRAM  
Document Title  
16M DDR SYNCHRONOUS SRAM  
Revision History  
Rev No.  
History  
DraftData  
Remark  
Rev. 0.0  
Initial document.  
Feb. 2003  
Advance  
Rev. 0.1  
Remove K7D163688B  
Jun. 2003  
Advance  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the  
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters  
of this device. If you have any questions, please contact the SAMSUNG branch office near your office, call or cortact Headquarters.  
Rev 0.1  
- 1 -  
Jun. 2003  

与K7D161888M-HC330相关器件

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DDR SRAM, 1MX18, CMOS, PBGA153, 14 X 22 MM, BGA-153
K7D163671B-HC30 SAMSUNG

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Standard SRAM, 512KX36, 1.9ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
K7D163671B-HC300 SAMSUNG

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DDR SRAM, 512KX36, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
K7D163671B-HC30T SAMSUNG

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Application Specific SRAM, 512KX36, 1.9ns, CMOS, PBGA153
K7D163671B-HC33 SAMSUNG

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Standard SRAM, 512KX36, 1.7ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
K7D163671B-HC33T SAMSUNG

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Application Specific SRAM, 512KX36, 1.7ns, CMOS, PBGA153
K7D163671B-HC37 SAMSUNG

获取价格

Standard SRAM, 512KX36, 1.7ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
K7D163671B-HC370 SAMSUNG

获取价格

DDR SRAM, 512KX36, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
K7D163671B-HC37T SAMSUNG

获取价格

Application Specific SRAM, 512KX36, 1.7ns, CMOS, PBGA153
K7D163671B-HC40 SAMSUNG

获取价格

Standard SRAM, 512KX36, CMOS, PBGA153