Datasheet > K7D161871M-HC40

K7D161871M-HC40

更新时间： 2024-09-18 05:09:03

品牌	Logo	应用领域
三星 - SAMSUNG		双倍数据速率静态存储器
页数	文件大小	规格书
14页	257K
描述
DDR SRAM, 1MX18, 1.6ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, FLIP CHIP, BGA-153

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K7D161871M-HC40 数据手册

K7D163671M

K7D161871M

512Kx36 & 1Mx18 SRAM

Document Title

16M DDR SYNCHRONOUS SRAM

Revision History

RevNo.

Rev. 0.0

Rev. 0.1

History

DraftData

March. 1999

April. 2000

Remark

Advance

Initial document.

Addition of New speed bin -25

New part number from KM736FS16017 to K7D163671M

Package height changed.

Rev. 0.2

Leakage current test condition changed from VDD to VDDQ

Package height changed.(From 2.4 to 2.5)

May. 2000

Advance

Rev. 0.3

Rev. 0.5

Rev. 0.6

Rev. 0.7

ZQ tolerance changed from 10% to 15%

Aug. 2000

Jan. 2001

April. 2001

May. 2001

Advance

Deleted -HC25 part(Part Number, Idd, AC Characterisctics)

Add-HC37 part(Part Number, Idd, AC Characteristics)

Preliminary

Clarification on the features and the timing waveforms regarding the

burst controllability.

Package thermal characteristics add

IDD37 x36 changed from 800mA to 850mA

IDD37 x18 changed from 750mA to 800mA

Rev. 1.0

Rev. 2.0

Add-HC40 part(Part Number, Idd, AC Characteristics)

Final specification release.

Sep. 2001

Jan. 2002

Final

Absolute Maximum Rating VDDQ changed from 3.13V to 2.3V

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the

right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters

of this device. If you have any questions, please contact the SAMSUNG branch office near your office, call or cortact Headquarters.

Rev 2.0

- 1 -

Jan. 2002

12 3 4 5 6 7...14

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与K7D161871M-HC40相关器件

型号	品牌	获取价格	描述	数据表
K7D161874B	SAMSUNG	获取价格	512Kx36 & 1Mx18 SRAM
K7D161874B-HC27	SAMSUNG	获取价格	512Kx36 & 1Mx18 SRAM
K7D161874B-HC30	SAMSUNG	获取价格	512Kx36 & 1Mx18 SRAM
K7D161874B-HC300	SAMSUNG	获取价格	DDR SRAM, 1MX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
K7D161874B-HC33	SAMSUNG	获取价格	512Kx36 & 1Mx18 SRAM
K7D161874B-HC330	SAMSUNG	获取价格	DDR SRAM, 1MX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
K7D161874B-HC37	SAMSUNG	获取价格	512Kx36 & 1Mx18 SRAM
K7D161874B-HC370	SAMSUNG	获取价格	DDR SRAM, 1MX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
K7D161888B-HC25	SAMSUNG	获取价格	Standard SRAM, 1MX18, 2.1ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
K7D161888B-HC30	SAMSUNG	获取价格	Standard SRAM, 1MX18, 1.9ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153