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IXFX12N90Q PDF预览

IXFX12N90Q

更新时间: 2024-11-18 21:08:51
品牌 Logo 应用领域
力特 - LITTELFUSE 开关脉冲晶体管
页数 文件大小 规格书
2页 145K
描述
Power Field-Effect Transistor, 12A I(D), 900V, 0.9ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PLUS247, 3 PIN

IXFX12N90Q 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:IN-LINE, R-PSIP-T3Reach Compliance Code:compliant
风险等级:5.76外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:900 V
最大漏极电流 (ID):12 A最大漏源导通电阻:0.9 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):48 A认证状态:Not Qualified
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXFX12N90Q 数据手册

 浏览型号IXFX12N90Q的Datasheet PDF文件第2页 
HiPerFETTM  
Power MOSFETs  
Q Class  
IXFH 12N90Q VDSS  
IXFT 12N90Q ID25  
IXFX 12N90Q RDS(on)  
= 900 V  
= 12 A  
= 0.9 Ω  
N-ChannelEnhancementMode  
AvalancheRated  
trr 200 ns  
Low Qg,High dv/dt  
Preliminary data sheet  
Symbol  
TestConditions  
Maximum Ratings  
TO-247AD(IXFH)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
900  
900  
V
V
VGS  
VGSM  
Continuous  
Transient  
±20  
±30  
V
V
(TAB)  
ID25  
IDM  
TC = 25°C  
TC = 25°C,  
12  
48  
A
A
PLUS 247
pulse width limited by TJM  
TC = 25°C  
IAR  
12  
30  
5
A
mJ  
EAR  
TC = 25°C  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
,
V/ns  
G
D
(TAB)  
PD  
TC = 25°C  
300  
W
TO-268 (D3) ( IXFT)  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
G
TL  
1.6 mm (0.063 in) from case for 10 s  
300  
°C  
(TAB)  
S
Md  
Mounting torque  
Mounting Force  
(TO-247)  
1.13/10 Nm/lb.in.  
G = Gate  
D
= Drain  
S = Source  
TAB = Drain  
F
(PLUS 247)  
20...120/4.5...27N/lbs  
c
Weight  
TO-247, PLUS 247  
TO-268  
6
4
g
g
Features  
z
Symbol  
TestConditions  
Characteristic Values  
IXYS advanced low Qg process  
z
(TJ = 25°C, unless otherwise specified)  
Low gate charge and capacitances  
- easier to drive  
min.  
typ.  
max.  
- faster switching  
VDSS  
VGS = 0 V, ID = 3 mA  
VDS = VGS, ID = 4 mA  
900  
V
V
z
z
z
International standard packages  
Low RDS (on)  
VGS(th)  
2.5  
5.5  
Unclamped Inductive Switching (UIS)  
rated  
z
IGSS  
VGS = ±20 VDC, VDS = 0  
±100  
nA  
Molding epoxies meet UL 94 V-0  
flammability classification  
IDSS  
VDS = 0.8 • VDSS  
VGS = 0 V  
T = 25°C  
50  
1
µA  
TJJ = 125°C  
mA  
Advantages  
z
RDS(on)  
V
= 10 V, ID = 0.5 ID25  
0.9  
Easy to mount  
PGuSlse test, t 300 µs, duty cycle d 2 %  
z
Space savings  
z
High power density  
© 2003 IXYS All rights reserved  
98572A(04/03)  

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