5秒后页面跳转
捷配首页

Datasheet > 存储 > SRAM> IS61LPS25636A-250B3I
IS61LPS25636A-250B3I PDF预览

IS61LPS25636A-250B3I

更新时间： 2024-11-13 04:58:35
品牌 Logo 应用领域
美国芯成 - ISSI 存储内存集成电路静态存储器
页数 文件大小 规格书
32页 209K
描述
256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, SINGLE CYCLE DESELECT STATIC RAM

阅读下载

中文翻译

获取价格

IS61LPS25636A-250B3I 技术参数

是否无铅：含铅是否Rohs认证：不符合
生命周期：Active零件包装代码：BGA
包装说明：TBGA, BGA165,11X15,40针数：165
Reach Compliance Code：compliantECCN代码：3A991.B.2.A
HTS代码：8542.32.00.41风险等级：5.48
Is Samacsys：N最长访问时间：2.6 ns
其他特性：PIPELINED ARCHITECTURE最大时钟频率 (fCLK)：250 MHz
I/O 类型：COMMONJESD-30 代码：R-PBGA-B165
JESD-609代码：e0长度：15 mm
内存密度：9437184 bit内存集成电路类型：CACHE SRAM
内存宽度：36功能数量：1
端子数量：165字数：262144 words
字数代码：256000工作模式：SYNCHRONOUS
最高工作温度：85 °C最低工作温度：-40 °C
组织：256KX36输出特性：3-STATE
封装主体材料：PLASTIC/EPOXY封装代码：TBGA
封装等效代码：BGA165,11X15,40封装形状：RECTANGULAR
封装形式：GRID ARRAY, THIN PROFILE并行/串行：PARALLEL
峰值回流温度（摄氏度）：NOT SPECIFIED电源：2.5/3.3,3.3 V
认证状态：Not Qualified座面最大高度：1.2 mm
最大待机电流：0.105 A最小待机电流：3.14 V
子类别：SRAMs最大压摆率：0.3 mA
最大供电电压 (Vsup)：3.465 V最小供电电压 (Vsup)：3.135 V
标称供电电压 (Vsup)：3.3 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Tin/Lead (Sn/Pb)端子形式：BALL
端子节距：1 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：13 mm
Base Number Matches：1

IS61LPS25636A-250B3I 数据手册

 浏览型号IS61LPS25636A-250B3I的Datasheet PDF文件第2页浏览型号IS61LPS25636A-250B3I的Datasheet PDF文件第3页浏览型号IS61LPS25636A-250B3I的Datasheet PDF文件第4页浏览型号IS61LPS25636A-250B3I的Datasheet PDF文件第5页浏览型号IS61LPS25636A-250B3I的Datasheet PDF文件第6页浏览型号IS61LPS25636A-250B3I的Datasheet PDF文件第7页 
®
IS61VPS25636A IS61LPS25636A  
IS61VPS51218A IS61LPS51218A  
ISSI  
256K x 36, 512K x 18  
MAY 2005  
9 Mb SYNCHRONOUS PIPELINED,  
SINGLE CYCLE DESELECT STATIC RAM  
DESCRIPTION  
FEATURES  
The ISSI IS61LPS/VPS25636A and IS61LPS/  
VPS51218Aarehigh-speed,low-powersynchronousstatic  
RAMsdesignedtoprovideburstable,high-performancememory  
for communication and networking applications. The  
IS61LPS/VPS25636A is organized as 262,144 words by  
36 bits and the IS61LPS/VPS51218A is organized as  
524,288 words by 18 bits. Fabricated with ISSI's ad-  
vanced CMOS technology, the device integrates a 2-bit  
burst counter, high-speed SRAM core, and high-drive  
capability outputs into a single monolithic circuit. All  
synchronous inputs pass through registers controlled by  
a positive-edge-triggered single clock input.  
• Internal self-timed write cycle  
• Individual Byte Write Control and Global Write  
• Clock controlled, registered address, data and  
control  
• Burst sequence control using MODE input  
• Three chip enable option for simple depth  
expansion and address pipelining  
• Common data inputs and data outputs  
• Auto Power-down during deselect  
• Single cycle deselect  
Write cycles are internally self-timed and are initiated by  
therisingedgeoftheclockinput. Writecyclescanbeone  
tofourbyteswideascontrolledbythewritecontrolinputs.  
• Snooze MODE for reduced-power standby  
• JTAG Boundary Scan for PBGA package  
• Power Supply  
Separatebyteenablesallowindividualbytestobewritten.  
The byte write operation is performed by using the byte  
write enable (BWE) input combined with one or more  
individual byte write signals (BWx). In addition, Global  
Write (GW) is available for writing all bytes at one time,  
regardless of the byte write controls.  
LPS: VDD 3.3V + 5%, VDDQ 3.3V/2.5V + 5%  
VPS: VDD 2.5V + 5%, VDDQ 2.5V + 5%  
Bursts can be initiated with either ADSP (Address Status  
Processor) or ADSC (Address Status Cache Controller)  
inputpins.Subsequentburstaddressescanbegenerated  
internally and controlled by the ADV (burst address  
advance) input pin.  
• JEDEC 100-Pin TQFP, 119-ball PBGA, and  
165-ball PBGA packages  
• Lead-free available  
The mode pin is used to select the burst sequence order,  
Linear burst is achieved when this pin is tied LOW.  
Interleave burst is achieved when this pin is tied HIGH or  
left floating.  
FAST ACCESS TIME  
Symbol  
tKQ  
Parameter  
250  
2.6  
4
200  
3.1  
5
Units  
ns  
Clock Access Time  
Cycle Time  
tKC  
ns  
Frequency  
250  
200  
MHz  
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability  
arisingoutoftheapplicationoruseofanyinformation, productsorservicesdescribedherein. Customersareadvisedtoobtainthelatestversionofthisdevicespecificationbeforerelyingonany  
publishedinformationandbeforeplacingordersforproducts.  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
Rev. A  
1
04/29/05  
1234567...32

中文翻译

下载PDF

与IS61LPS25636A-250B3I相关器件

型号 品牌 获取价格 描述 数据表
IS61LPS25636A-250TQ ISSI

获取价格

 		256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, SINGLE CYCLE DESELECT STATIC RAM
IS61LPS25636A-250TQI ISSI

获取价格

 		256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, SINGLE CYCLE DESELECT STATIC RAM
IS61LPS25636B-200TQLI ISSI

获取价格

 		Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LQFP-100
IS61LPS25636D-133TQI ISSI

获取价格

 		Cache SRAM, 256KX36, 4ns, CMOS, PQFP100, TQFP-100
IS61LPS25636D-166B ISSI

获取价格

 		Cache SRAM, 256KX36, 3.5ns, CMOS, PBGA119, PLASTIC, BGA-119
IS61LPS25636D-166BI ISSI

获取价格

 		Cache SRAM, 256KX36, 3.5ns, CMOS, PBGA119, PLASTIC, BGA-119
IS61LPS25636D-166TQI ISSI

获取价格

 		Cache SRAM, 256KX36, 3.5ns, CMOS, PQFP100, TQFP-100
IS61LPS25636D-200BI ISSI

获取价格

 		Cache SRAM, 256KX36, 3.1ns, CMOS, PBGA119, PLASTIC, BGA-119
IS61LPS25636D-200TQI ISSI

获取价格

 		Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, TQFP-100
IS61LPS25636D-225TQI ISSI

获取价格

 		Cache SRAM, 256KX36, 2.8ns, CMOS, PQFP100, TQFP-100

与IS61LPS25636A-250B3I相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证