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IRLML6302TRPBF PDF预览

IRLML6302TRPBF

更新时间: 2024-11-18 12:02:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体小信号场效应晶体管开关光电二极管
页数 文件大小 规格书
8页 285K
描述
HEXFET® Power MOSFET

IRLML6302TRPBF 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:MICRO-3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.95
Factory Lead Time:15 weeks风险等级:0.59
Is Samacsys:N其他特性:LOGIC LEVEL COMPATIBLE
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):0.78 A最大漏极电流 (ID):0.78 A
最大漏源导通电阻:0.6 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):0.54 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRLML6302TRPBF 数据手册

 浏览型号IRLML6302TRPBF的Datasheet PDF文件第2页浏览型号IRLML6302TRPBF的Datasheet PDF文件第3页浏览型号IRLML6302TRPBF的Datasheet PDF文件第4页浏览型号IRLML6302TRPBF的Datasheet PDF文件第5页浏览型号IRLML6302TRPBF的Datasheet PDF文件第6页浏览型号IRLML6302TRPBF的Datasheet PDF文件第7页 
PD - 94947B  
IRLML6302PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l P-Channel MOSFET  
l SOT-23 Footprint  
VDSS = -20V  
l Low Profile (<1.1mm)  
l Available in Tape and Reel  
l Fast Switching  
RDS(on) = 0.60Ω  
l Lead-Free  
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
known for, provides the designer with an extremely efficient  
and reliable device for use in a wide variety of applications.  
A customized leadframe has been incorporated into the  
standard SOT-23 package to produce a HEXFET Power  
MOSFET with the industry's smallest footprint. This  
package, dubbed the Micro3, is ideal for applications  
where printed circuit board space is at a premium. The  
low profile (<1.1mm) of the Micro3 allows it to fit easily into  
extremely thin application environments such as portable  
electronics and PCMCIA cards.  
Micro3TM  
Absolute Maximum Ratings  
Parameter  
Max.  
-0.78  
Units  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current   
-0.62  
A
-4.9  
PD@TA = 25°C  
Power Dissipation  
540  
mW  
mW/°C  
V
Linear Derating Factor  
4.3  
VGS  
Gate-to-Source Voltage  
± 12  
dv/dt  
TJ,TSTG  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
-5.0  
V/ns  
°C  
-55 to + 150  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambient „  
Typ.  
–––  
Max.  
230  
Units  
°C/W  
RθJA  
www.irf.com  
1
08/27/07  

IRLML6302TRPBF 替代型号

型号 品牌 替代类型 描述 数据表
IRLML6302TR INFINEON

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generation v technology
IRLML6302PBF INFINEON

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