IRLML6346
N-Channel Power MOSFET
FEATURES
Ultra low on-resistance:VDS=30V,RDS(ON)≤63mΩ@VGS=4.5V,ID=3.4A
For PWM application
For Load switch application
Surface Mount device
SOT-23
MECHANICAL DATA
Case: SOT-23
Case Material: Molded Plastic. UL f lammability
Classification Rating: 94V-0
Weight: 0.008 grams (approximate)
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Symbol
Parameter
Drain-Source Voltage
Max.
30
Units
V
VDS
ID @ TA = 25°C
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
3.4
ID @ TA = 70°C
IDM
2.7
A
17
PD @TA = 25°C
PD @TA = 70°C
1.3
Maximum Power Dissipation
W
0.8
0.01
Maximum Power Dissipation
Linear Derating Factor
W/°C
V
VGS
± 12
Gate-to-Source Voltage
TJ, TSTG
RJA
-55 to + 150
100
Junction and Storage Temperature Range
Junction-to-Ambient ③
°C
°C/W
RJA
Junction-to-Ambient (t<10s)
99
Electric Characteristics @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Drain-to-Source Breakdown Voltage
Min. Typ. Max. Units
Conditions
V(BR)DSS
30
–––
–––
V
VGS = 0V, ID = 250μA
V/°C Reference to 25°C, ID = 1mA
GS = 4.5V, ID = 3.4A
V(BR)DSS/TJ
RDS(on)
Breakdown Voltage Temp. Coefficient
–––
–––
–––
0.5
0.02
46
59
0.8
–––
–––
63
80
1.1
1.0
V
m
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
VGS = 2.5V, ID = 2.7A
VDS = VGS, ID = 10μA
VDS =24V, VGS = 0V
VGS(th)
V
–––
IDSS
μA
Drain-to-Source Leakage Current
–––
–––
–––
–––
–––
–––
150
100
-100
VDS = 24V, VGS = 0V, TJ = 125°C
VGS = 12V
GS = -12V
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
nA
V
RG
gfs
Qg
Qgs
Qgd
td(on)
tr
Internal Gate Resistance
Forward Transconductance
–––
9.5
3.9
–––
–––
–––
S
VDS = 10V, ID = 3.4A
ID = 3.4A
VDS =15V
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
2.9
0.13
1.1
3.3
4.0
12
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
nC
ns
VGS = 4.5V
VDD =15V
ID = 1.0A
RG = 6.8
td(off)
tf
Turn-Off Delay Time
Fall Time
4.9
270
32
V
GS = 4.5V
GS = 0V
Ciss
Coss
Crss
Input Capacitance
V
Output Capacitance
Reverse Transfer Capacitance
VDS = 24V
pF
21
ƒ = 1.0MHz
IS
Continuous Source Current
MOSFET symbol
D
–––
–––
–––
–––
1.3
17
(Body Diode)
Pulsed Source Current
showing the
integral reverse
A
V
G
ISM
S
(Body Diode)
Diode Forward Voltage
p-n junction diode.
TJ = 25°C, IS = 3.4A, VGS = 0V
VSD
trr
–––
–––
–––
–––
8.8
2.7
1.2
13
Reverse Recovery Time
Reverse Recovery Charge
ns TJ = 25°C, VR = 24V, IF=1.3A
di/dt = 100A/μs
nC
Qrr
4.1
Notes:
Repetitive rating; pulse width limited by max. junction temperature.
Pulse width 400μs; duty cycle 2%.
Surface mounted on 1 in square Cu board.
6
1 /
©GUANGDONGHOTTECHINDUSTRIALCO.,LTD
E-mail:hkt@heketai.com