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IRLML6346 PDF预览

IRLML6346

更新时间: 2024-11-21 18:09:59
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合科泰 - HOTTECH /
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6页 776K
描述
SOT-23

IRLML6346 数据手册

 浏览型号IRLML6346的Datasheet PDF文件第2页浏览型号IRLML6346的Datasheet PDF文件第3页浏览型号IRLML6346的Datasheet PDF文件第4页浏览型号IRLML6346的Datasheet PDF文件第5页浏览型号IRLML6346的Datasheet PDF文件第6页 
IRLML6346  
N-Channel Power MOSFET  
FEATURES  
Ultra low on-resistance:VDS=30V,RDS(ON)≤63mΩ@VGS=4.5V,ID=3.4A  
For PWM application  
For Load switch application  
Surface Mount device  
SOT-23  
MECHANICAL DATA  
Case: SOT-23  
Case Material: Molded Plastic. UL f lammability  
Classification Rating: 94V-0  
Weight: 0.008 grams (approximate)  
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Drain-Source Voltage  
Max.  
30  
Units  
V
VDS  
ID @ TA = 25°C  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
3.4  
ID @ TA = 70°C  
IDM  
2.7  
A
17  
PD @TA = 25°C  
PD @TA = 70°C  
1.3  
Maximum Power Dissipation  
W
0.8  
0.01  
Maximum Power Dissipation  
Linear Derating Factor  
W/°C  
V
VGS  
± 12  
Gate-to-Source Voltage  
TJ, TSTG  
RJA  
-55 to + 150  
100  
Junction and Storage Temperature Range  
Junction-to-Ambient  
°C  
°C/W  
RJA  
Junction-to-Ambient (t<10s)  
99  
Electric Characteristics @ TJ = 25°C (unless otherwise specified)  
Symbol  
Parameter  
Drain-to-Source Breakdown Voltage  
Min. Typ. Max. Units  
Conditions  
V(BR)DSS  
30  
–––  
–––  
V
VGS = 0V, ID = 250μA  
V/°C Reference to 25°C, ID = 1mA  
GS = 4.5V, ID = 3.4A  
V(BR)DSS/TJ  
RDS(on)  
Breakdown Voltage Temp. Coefficient  
–––  
–––  
–––  
0.5  
0.02  
46  
59  
0.8  
–––  
–––  
63  
80  
1.1  
1.0  
V
m
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
VGS = 2.5V, ID = 2.7A  
VDS = VGS, ID = 10μA  
VDS =24V, VGS = 0V  
VGS(th)  
V
–––  
IDSS  
μA  
Drain-to-Source Leakage Current  
–––  
–––  
–––  
–––  
–––  
–––  
150  
100  
-100  
VDS = 24V, VGS = 0V, TJ = 125°C  
VGS = 12V  
GS = -12V  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
nA  
V
RG  
gfs  
Qg  
Qgs  
Qgd  
td(on)  
tr  
Internal Gate Resistance  
Forward Transconductance  
–––  
9.5  
3.9  
–––  
–––  
–––  
S
VDS = 10V, ID = 3.4A  
ID = 3.4A  
VDS =15V  
Total Gate Charge  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
2.9  
0.13  
1.1  
3.3  
4.0  
12  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
nC  
ns  
VGS = 4.5V  
VDD =15V  
ID = 1.0A  
RG = 6.8  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
4.9  
270  
32  
V
GS = 4.5V  
GS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
V
Output Capacitance  
Reverse Transfer Capacitance  
VDS = 24V  
pF  
21  
ƒ = 1.0MHz  
IS  
Continuous Source Current  
MOSFET symbol  
D
–––  
–––  
–––  
–––  
1.3  
17  
(Body Diode)  
Pulsed Source Current  
showing the  
integral reverse  
A
V
G
ISM  
S
(Body Diode)  
Diode Forward Voltage  
p-n junction diode.  
TJ = 25°C, IS = 3.4A, VGS = 0V  
VSD  
trr  
–––  
–––  
–––  
–––  
8.8  
2.7  
1.2  
13  
Reverse Recovery Time  
Reverse Recovery Charge  
ns TJ = 25°C, VR = 24V, IF=1.3A  
di/dt = 100A/μs  
nC  
Qrr  
4.1  
Notes:  
 Repetitive rating; pulse width limited by max. junction temperature.  
‚ Pulse width 400μs; duty cycle 2%.  
Surface mounted on 1 in square Cu board.  
ƒ
6
1 /  
©GUANGDONGHOTTECHINDUSTRIALCO.,LTD  
E-mail:hkt@heketai.com  

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