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IRLL110TR PDF预览

IRLL110TR

更新时间: 2024-10-01 05:39:31
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关光电二极管
页数 文件大小 规格书
8页 1442K
描述
Power MOSFET

IRLL110TR 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:TO-261AA
包装说明:SMALL OUTLINE, R-PDSO-G3针数:4
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.13Is Samacsys:N
Base Number Matches:1

IRLL110TR 数据手册

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IRLL110, SiHLL110  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• Surface Mount  
100  
• Available in Tape and Reel  
• Dynamic dV/dt Rating  
Available  
R
DS(on) (Ω)  
VGS = 5.0 V  
0.54  
RoHS*  
Qg (Max.) (nC)  
6.1  
2.6  
3.3  
• Repetitive Avalanche Rated  
• Logic-Level Gate Drive  
• RDS(on) Specified at VGS = 4 V and 5 V  
• Fast Switching  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
Configuration  
Single  
• Lead (Pb)-free Available  
D
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effictiveness.  
SOT-223  
G
The SOT-223 package is designed for surface-mounting  
using vapor phase, infrared, or wave soldering techniques.  
Its unique package design allows for easy automatic  
pick-and-place as with other SOT or SOIC packages but has  
the added advantage of improved thermal performace due to  
an enlarged tab for heatsinking. Power dissipation of greater  
than 1.25 W is possible in a typical surface mount  
application.  
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
SOT-223  
SOT-223  
IRLL110PbF  
SiHLL110-E3  
IRLL110  
IRLL110TRPbFa  
SiHLL110T-E3a  
IRLL110TRa  
SiHLL110Ta  
Lead (Pb)-free  
SnPb  
SiHLL110  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
SYMBOL  
LIMIT  
100  
UNIT  
VDS  
V
VGS  
10  
T
C = 25 °C  
1.5  
Continuous Drain Current  
V
GS at 5.0 V  
ID  
TC =100°C  
0.93  
12  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.025  
0.017  
50  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
EAS  
IAR  
mJ  
A
1.5  
Repetitive Avalanche Energya  
EAR  
0.31  
3.1  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TC = 25 °C  
PD  
W
V/ns  
°C  
TA = 25 °C  
2.0  
dV/dt  
5.5  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 25 mH, RG = 25 Ω, IAS = 1.5 A (see fig. 12).  
c. ISD 5.6 A, dI/dt 75 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91320  
S-81366-Rev. A, 07-Jul-08  
www.vishay.com  
1

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