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IRHNA57060 PDF预览

IRHNA57060

更新时间: 2024-11-05 22:21:51
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 109K
描述
200V, N-CHANNEL

IRHNA57060 数据手册

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PD - 91838C  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (SMD-2)  
IRHNA57260  
200V, N-CHANNEL  
TECHNOLOGY  
R
5
™
Product Summary  
Part Number Radiation Level RDS(on)  
IRHNA57260 100K Rads (Si) 0.038Ω  
IRHNA53260 300K Rads (Si) 0.038Ω  
IRHNA54260 600K Rads (Si) 0.038Ω  
ID  
55A  
55A  
55A  
IRHNA58260 1000K Rads (Si) 0.04355A  
SMD-2  
International Rectifier’s R5TM technology provides  
high performance power MOSFETs for space appli-  
cations. These devices have been characterized for  
Single Event Effects (SEE) with useful performance  
up to an LET of 80 (MeV/(mg/cm2)). The combination  
of low RDS(on) and low gate charge reduces the power  
losses in switching applications such as DC to DC  
converters and motor control. These devices retain  
all of the well established advantages of MOSFETs  
such as voltage control, fast switching, ease of paral-  
leling and temperature stability of electrical param-  
eters.  
Features:  
n
n
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Ultra Low RDS(on)  
Low Total Gate Charge  
Proton Tolerant  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Surface Mount  
Ceramic Package  
Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
55  
D
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
35  
220  
D
GS  
C
I
Pulsed Drain Current ➀  
Max. Power Dissipation  
DM  
@ T = 25°C  
P
300  
W
W/°C  
V
D
C
Linear Derating Factor  
2.4  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy ➁  
Avalanche Current ➀  
±20  
GS  
E
380  
mJ  
A
AS  
I
55  
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➂  
Operating Junction  
30  
mJ  
V/ns  
AR  
dv/dt  
9.2  
T
-55 to 150  
J
T
Storage Temperature Range  
oC  
g
STG  
Pckg. Mounting Surface Temp.  
Weight  
300 (for 5s)  
3.3 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
11/19/99  

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