PD -9.1668A
IRG4ZC70UD
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
Features
Surface Mountable
UltraFast CoPack IGBT
C
n-channel
● UltraFast IGBT optimized for high switching frequencies
VCES = 600V
● IGBT co-packaged with HEXFRED™ ultrafast,
ultra-soft recovery antiparallel diodes for use in
bridge configurations
VCE( )typ = 1.5V
ON
● Low gate charge
● Low profile low inductance SMD-10 package
● Separated control & Power-connections for
G
@VGE = 15V, IC = 50A
E(k)
E
easy paralleling
● Inherently coplanar pins and tab
● Easy solder inspection and cleaning
Benefits
● Highest power density and efficiency available
● HEXFRED diodes optimized for performance with IGBTs;
Minimized recovery characteristics
● IGBTs optimized for specific application conditions; high input impedance
requires low gate drive power
● Low noise and interference
SMD-10
Absolute Maximum Ratings
Parameter
Max.
600
Units
V
VCES
Collector-to-Emitter Breakdown Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current ➀
IC @ TC = 25°C
100
IC @ TC = 100°C
50
A
ICM
400
ILM
Clamped Inductive Load Current ➁
Diode Continuous Forward Current
Diode Maximum Forward Current
Gate-to-Emitter Voltage
400
IF @ TC = 100°C
50
IFM
400
VGE
± 20
350
V
PD @ TC = 25°C
Maximum Power Dissipation
W
°C
PD @ TC = 100°C Maximum Power Dissipation
140
TJ
Operating Junction and
-55 to + 150
TSTG
Storage Temperature Range
Thermal Resistance
Parameter
Min.
—
Typ.
—
Max.
0.36
0.69
—
Units
°C/W
RθJC
RθJC
RθCS
Wt
Junction-to-Case - IGBT
Junction-to-Case - Diode
SMD-10 Case-to-Heatsink (typical), *
Weight
—
—
—
0.59
—
6.0(0.21)
—
g (oz)
Notes: ➀ Repetitive rating: VGE = 20V; pulse width limited by
➂ Pulse width ≤ 80µs; duty factor ≤ 0.1%.
➃ Pulse width 5.0µs, single shot.
maximum junction temperature (figure 20)
➁ VCC = 80%(VCES), VGE = 20V, L=10µH, RG= 5.0Ω
(figure 19)
* Assumes device soldered to 3.0 oz. Cu on 3.0mm IMS/Aluminum board, mounted to flat, greased heatsink.