Datasheet > IRG6IC30UPBF

IRG6IC30UPBF

更新时间： 2024-10-01 05:39:31

品牌	Logo	应用领域
英飞凌 - INFINEON		光电二极管双极性晶体管
页数	文件大小	规格书
7页	286K
描述
PDP TRENCH IGBT

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中文翻译

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数据手册

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IRG6IC30UPBF 数据手册

PD - 97386

IRG6IC30UPbF

Key Parameters

PDP TRENCH IGBT

Features

V_CEmin

600

1.50

250

150

Advanced Trench IGBT Technology

Optimized for Sustain and Energy Recovery

circuits in PDP applications

_CE(ON)typ. @ I_C= 25A

_RPmax @ T_C= 25°C

°C

Low V_CE(on)and Energy per Pulse (E_PULSE

for improved panel efficiency

)

T_Jmax

High repetitive peak current capability

Lead Free package

TO-220AB

Full-Pak

n-channel

Gate

Collector

Emitter

Description

This IGBT is specifically designed for applications in Plasma Display Panels. This device utilizes advanced

trenchIGBTtechnologytoachievelowV_CE(on)andlowE_PULSE^TMratingpersiliconareawhichimprovepanel

efficiency. Additional features are 150°C operating junction temperature and high repetitive peak current

capability. These features combine to make this IGBT a highly efficient, robust and reliable device for PDP

applications.

Absolute Maximum Ratings

Max.

Parameter

Units

V_GE

±30

Gate-to-Emitter Voltage

I_C@ T_C= 25°C

I_C@ T_C= 100°C

I_RP@ T_C= 25°C

P_D@T_C= 25°C

P_D@T_C= 100°C

Continuous Collector Current, V_GE@ 15V

Continuous Collector, V_GE@ 15V

Repetitive Peak Current

250

Power Dissipation

0.30

Linear Derating Factor

W/°C

°C

T_J

-40 to + 150

Operating Junction and

T_STG

Storage Temperature Range

Soldering Temperature for 10 seconds

Mounting Torque, 6-32 or M3 Screw

300

10lb in (1.1N m)

Thermal Resistance

Parameter

Typ.

–––

Max.

3.1

Units

°C/W

R_θ

Junction-to-Case

Junction-to-Ambient

R_θJA

–––

www.irf.com

03/31/09

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中文翻译

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