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IRFR540ZPBF PDF预览

IRFR540ZPBF

更新时间: 2024-11-24 12:28:19
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
11页 359K
描述
Advanced Process Technology

IRFR540ZPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:HALOGEN AND LEAD FREE, PLASTIC, DPAK-3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.12
其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE雪崩能效等级(Eas):39 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):35 A
最大漏极电流 (ID):35 A最大漏源导通电阻:0.0285 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-252AA
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):91 W最大脉冲漏极电流 (IDM):140 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFR540ZPBF 数据手册

 浏览型号IRFR540ZPBF的Datasheet PDF文件第2页浏览型号IRFR540ZPBF的Datasheet PDF文件第3页浏览型号IRFR540ZPBF的Datasheet PDF文件第4页浏览型号IRFR540ZPBF的Datasheet PDF文件第5页浏览型号IRFR540ZPBF的Datasheet PDF文件第6页浏览型号IRFR540ZPBF的Datasheet PDF文件第7页 
PD - 96141B  
IRFR540ZPbF  
IRFU540ZPbF  
HEXFET® Power MOSFET  
Features  
l
l
l
l
l
l
l
Advanced Process Technology  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free  
D
VDSS = 100V  
Halogen-Free  
RDS(on) = 28.5mΩ  
G
Description  
ThisHEXFET® PowerMOSFETutilizesthelatest  
processing techniques to achieve extremely low  
on-resistancepersiliconarea.Additionalfeatures  
of this design are a 175°C junction operating  
temperature, fast switching speed and improved  
repetitive avalanche rating. These features  
combinetomakethisdesignanextremelyefficient  
and reliable device for use in a wide variety of  
applications.  
ID = 35A  
S
D-Pak  
I-Pak  
IRFR540ZPbF  
IRFU540ZPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Pulsed Drain Current  
I
I
I
@ T = 25°C  
C
35  
D
D
@ T = 100°C  
C
25  
140  
91  
A
DM  
P
@T = 25°C Power Dissipation  
W
D
C
Linear Derating Factor  
0.61  
± 20  
W/°C  
V
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
GS  
EAS (Thermally limited)  
39  
75  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (Tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
Operating Junction and  
EAR  
mJ  
T
J
-55 to + 175  
T
Storage Temperature Range  
°C  
STG  
Reflow Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
300  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.64  
40  
Units  
Junction-to-Case  
RθJC  
RθJA  
RθJA  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
°C/W  
110  
HEXFET® isaregisteredtrademarkofInternationalRectifier.  
www.irf.com  
1
09/30/10  

IRFR540ZPBF 替代型号

型号 品牌 替代类型 描述 数据表
IRFR540ZTRPBF INFINEON

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