PD - 96344
AUTOMOTIVE GRADE
AUIRFR5410
HEXFET® Power MOSFET
Features
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AdvancedPlanarTechnology
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P-ChannelMOSFET
LowOn-Resistance
Dynamic dV/dT Rating
175°COperatingTemperature
Fast Switching
Fully Avalanche Rated
Repetitive Avalanche Allowed up to
Tjmax
D
V(BR)DSS
-100V
0.205
RDS(on) max.
ID
G
-13A
S
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Lead-Free,RoHSCompliant
Automotive Qualified *
Description
D
SpecificallydesignedforAutomotiveapplications,
this Cellular Planar design of HEXFET® Power
MOSFETsutilizesthelatestprocessingtechniques
toachievelowon-resistancepersiliconarea. This
benefitcombinedwiththefastswitchingspeedand
ruggedized device design that HEXFET power
MOSFETsarewellknownfor,providesthedesigner
with an extremely efficient and reliable device for
use in Automotive and a wide variety of other
applications.
S
G
D-Pak
AUIRFR5410
G
Gate
D
S
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Max.
-13
Parameter
Units
Continuous Drain Current, VGS @ 10V
@ T = 25°C
C
I
I
I
D
D
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
-8.2
-52
@ T = 100°C
A
C
DM
66
P
@T = 25°C Power Dissipation
W
W/°C
V
D
C
0.53
± 20
Linear Derating Factor
Gate-to-Source Voltage
V
GS
EAS
IAR
194
Single Pulse Avalanche Energy (Thermally Limited)
mJ
-8.4
6.3
Avalanche Current
A
EAR
dv/dt
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
mJ
-5.0
V/ns
-55 to + 150
T
T
J
Storage Temperature Range
°C
STG
300
Soldering Temperature, for 10 seconds (1.6mm from case )
Thermal Resistance
Parameter
Typ.
Max.
1.9
Units
RJC
RJA
RJA
Junction-to-Case
–––
–––
–––
Junction-to-Ambient (PCB mount)
Junction-to-Ambient
50
°C/W
110
www.kersemi.com
1
12/06/10