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IRFR5410TRR PDF预览

IRFR5410TRR

更新时间: 2024-01-09 04:36:25
品牌 Logo 应用领域
科盛美 - KERSEMI /
页数 文件大小 规格书
10页 3880K
描述
AUTOMOTIVE GRADE

IRFR5410TRR 技术参数

是否Rohs认证: 符合生命周期:Not Recommended
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:6.92
其他特性:HIGH RELIABILITY, AVALANCHE RATED, ULTRA-LOW RESISTANCE雪崩能效等级(Eas):194 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):13 A
最大漏极电流 (ID):13 A最大漏源导通电阻:0.205 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-252AA
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):66 W最大脉冲漏极电流 (IDM):52 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFR5410TRR 数据手册

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PD - 96344  
AUTOMOTIVE GRADE  
AUIRFR5410  
HEXFET® Power MOSFET  
Features  
AdvancedPlanarTechnology  
P-ChannelMOSFET  
LowOn-Resistance  
Dynamic dV/dT Rating  
175°COperatingTemperature  
Fast Switching  
Fully Avalanche Rated  
Repetitive Avalanche Allowed up to  
Tjmax  
D
V(BR)DSS  
-100V  
0.205  
RDS(on) max.  
ID  
G
-13A  
S
Lead-Free,RoHSCompliant  
Automotive Qualified *  
Description  
D
SpecificallydesignedforAutomotiveapplications,  
this Cellular Planar design of HEXFET® Power  
MOSFETsutilizesthelatestprocessingtechniques  
toachievelowon-resistancepersiliconarea. This  
benefitcombinedwiththefastswitchingspeedand  
ruggedized device design that HEXFET power  
MOSFETsarewellknownfor,providesthedesigner  
with an extremely efficient and reliable device for  
use in Automotive and a wide variety of other  
applications.  
S
G
D-Pak  
AUIRFR5410  
G
Gate  
D
S
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
-13  
Parameter  
Units  
Continuous Drain Current, VGS @ 10V  
@ T = 25°C  
C
I
I
I
D
D
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
-8.2  
-52  
@ T = 100°C  
A
C
DM  
66  
P
@T = 25°C Power Dissipation  
W
W/°C  
V
D
C
0.53  
± 20  
Linear Derating Factor  
Gate-to-Source Voltage  
V
GS  
EAS  
IAR  
194  
Single Pulse Avalanche Energy (Thermally Limited)  
mJ  
-8.4  
6.3  
Avalanche Current  
A
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
mJ  
-5.0  
V/ns  
-55 to + 150  
T
T
J
Storage Temperature Range  
°C  
STG  
300  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
Max.  
1.9  
Units  
RJC  
RJA  
RJA  
Junction-to-Case  
–––  
–––  
–––  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
50  
°C/W  
110  
www.kersemi.com  
1
12/06/10  

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种类:P-Channel;漏源电压(Vdss):-60V;持续漏极电流(Id)(在25°C