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IRFR5305PBF

更新时间: 2024-11-24 12:04:59
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体晶体管开关脉冲PC局域网
页数 文件大小 规格书
10页 3867K
描述
Ultra Low On-Resistance

IRFR5305PBF 数据手册

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PD-95025A  
IRFR5305PbF  
IRFU5305PbF  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l Surface Mount (IRFR5305)  
l Straight Lead (IRFU5305)  
l Advanced Process Technology  
l FastSwitching  
D
VDSS = -55V  
RDS(on) = 0.065Ω  
ID = -31A  
l Fully Avalanche Rated  
l Lead-Free  
G
S
Description  
FifthGenerationHEXFETsfromInternationalRectifierutilize  
advanced processing techniques to achieve extremely low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
HEXFET® Power MOSFETs are well known for, provides  
the designer with an extremely efficient and reliable device  
for use in a wide variety of applications.  
The D-Pak is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU series) is for through-hole mounting  
applications. Power dissipation levels up to 1.5 watts are  
possible in typical surface mount applications.  
D-Pak  
IRFR5305  
I-Pak  
IRFU5305  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current†  
-31  
-22  
A
-110  
PD @TC = 25°C  
PowerDissipation  
110  
W
W/°C  
V
LinearDeratingFactor  
0.71  
VGS  
EAS  
IAR  
Gate-to-SourceVoltage  
± 20  
280  
Single Pulse Avalanche Energy‚†  
AvalancheCurrent†  
mJ  
A
-16  
EAR  
dv/dt  
TJ  
RepetitiveAvalancheEnergy  
Peak Diode Recovery dv/dt ƒ†  
OperatingJunctionand  
11  
mJ  
V/ns  
-5.0  
-55 to + 175  
TSTG  
StorageTemperatureRange  
SolderingTemperature,for10seconds  
Mounting torque, 6-32 or M3 srew  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
ThermalResistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
1.4  
50  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Ambient(PCBmount)*  
Junction-to-Ambient**  
–––  
°C/W  
–––  
110  
www.kersemi.com  
1
12/13/04  

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