IRF9383MPbF
DirectFET® P-Channel Power MOSFET
Typical values (unless otherwise specified)
Applications
VDSS
-30V max ±20V max
VGS
RDS(on)
RDS(on)
l Isolation Switch for Input Power or Battery Application
l High Side Switch for Inverter Applications
2.3mΩ@-10V 3.8mΩ@-4.5V
Qg tot
Qgd
Qgs2
Qrr
Qoss Vgs(th)
Features and Benefits
67nC
29nC
9.4nC 315nC 59nC
-1.8V
l Environmentaly Friendly Product
l RoHs Compliant Containing no Lead,
no Bromide and no Halogen
S
G
D
l Common-Drain P-Channel MOSFETs Provides
High Level of Integration and Very Low RDS(on)
D
S
DirectFET ISOMETRIC
MX
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SQ
SX
ST
MQ
MX
MT
MP
MC
Description
The IRF9383MTRPbF combines the latest HEXFET® P-Channel Power MOSFET Silicon technology with the advanced DirectFET®
packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.6 mm profile. The DirectFET®
package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or
convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The
DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance
by 80%.
Orderable part number
Package Type
Standard Pack
Note
Form
Tape and Reel
Tape and Reel
Quantity
4800
1000
IRF9383MTRPbF
IRF9383MTR1PbF
DirectFET Medium Can
DirectFET Medium Can
"TR1" suffix EOL notice #264
Absolute Maximum Ratings
Max.
-30
Parameter
Units
VDS
Drain-to-Source Voltage
V
±20
-22
V
Gate-to-Source Voltage
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
@ TA = 25°C
D
D
D
-17
@ TA = 70°C
@ TC = 25°C
A
-160
-180
DM
12
10
8
14.0
12.0
10.0
8.0
I = -18A
D
I
= -22A
D
V
V
V
= -24V
= -15V
= -6.0V
DS
DS
DS
6
6.0
T = 125°C
J
4
4.0
2
2.0
T
= 25°C
J
0
0.0
2
4
6
8
10 12 14 16 18 20
0
20 40 60 80 100 120 140 160 180
Total Gate Charge (nC)
Q
G
-V
Gate -to -Source Voltage (V)
GS,
Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage
Fig 1. Typical On-Resistance vs. Gate Voltage
Notes:
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
www.irf.com © 2014 International Rectifier
Submit Datasheet Feedback
February 28, 2014
1