APPROVED (NOT RELEASED)
IRF9394MPbF
DirectFET™ dual P-Channel Power MOSFET
Typical values (unless otherwise specified)
Applications
VDSS
VGS
RDS(on)
RDS(on)
Isolation Switch for Input Power or Battery Application
-30V max ±20V max
5.3m@-10V 8.5m@-4.5V
Features and Benefits
Qg tot Qgd
Qgs2
Qrr
Qoss Vgs(th)
Environmentally Friendly Product
ROHS compliant, Halogen-Free
Dual Common-Drain P-Channel MOSFETs Provides High
Level of Integration and Very Low RDS(on)
32nC 15nC 3.2nC 62nC 23nC -1.8V
G
G
S
S
D
D
S
S
DirectFET™ ISOMETRIC
MC
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SQ
SX
ST
MQ
MX
MT
MP
MC
Description
The IRF9394MTRPbF combines the latest HEXFET® P-Channel Power MOSFET Silicon technology with the advanced
DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only
0.54 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB
assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is
followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to
maximize thermal transfer in power systems, improving previous best thermal resistance by 80%
Standard Pack
Orderable Part Number
Package Type
Note
Form
Quantity
IRF9394MTRPbF
DirectFET Medium Can
Tape and Reel
4800
“TR” suffix
Absolute Maximum Ratings
Symbol
Parameter
Max.
Units
VDS
VGS
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
-30
V
±20
-14
-11
-75
ID @ TA = 25°C
ID @ TA = 70°C
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V
A
Pulsed Drain Current
-110
IDM
14.0
12.0
10.0
8.0
24
20
16
12
8
I
= -11A
V
D
= -24V
DS
= -15V
I
= -14A
D
V
DS
VDS= -6V
6.0
T
= 125°C
= 25°C
J
4.0
4
2.0
T
J
0
0.0
2
4
6
8
10 12 14 16 18 20
0
20
Q
40
60
80
Total Gate Charge (nC)
G
-V
Gate -to -Source Voltage (V)
GS,
Fig 1. Typical On– Resistance vs. Gate Voltage
Fig 2. Typical Gate Charge vs. Gate-to-Source Voltage
Notes:
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
TC measured with thermocouple mounted to top (Drain) of part.
Repetitive rating; pulse width limited by max. junction temperature.
1
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© 2014 International Rectifier
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July 9, 2014