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IRF9510STRL PDF预览

IRF9510STRL

更新时间: 2024-11-18 12:56:31
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 176K
描述
Power MOSFET

IRF9510STRL 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:D2PAK包装说明:TO-263, 3 PIN
针数:4Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.04Is Samacsys:N
雪崩能效等级(Eas):200 mJ外壳连接:DRAIN
配置:SINGLE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):4 A最大漏极电流 (ID):4 A
最大漏源导通电阻:1.2 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e0元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):43 W最大脉冲漏极电流 (IDM):16 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:TIN LEAD
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF9510STRL 数据手册

 浏览型号IRF9510STRL的Datasheet PDF文件第2页浏览型号IRF9510STRL的Datasheet PDF文件第3页浏览型号IRF9510STRL的Datasheet PDF文件第4页浏览型号IRF9510STRL的Datasheet PDF文件第5页浏览型号IRF9510STRL的Datasheet PDF文件第6页浏览型号IRF9510STRL的Datasheet PDF文件第7页 
IRF9510S, SiHF9510S  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
Halogen-free According to IEC 61249-2-21  
Definition  
• Surface Mount  
• Available in Tape and Reel  
• Dynamic dV/dt Rating  
• Repetitive Avalanche Rated  
• P-Channel  
- 100  
RDS(on) ()  
VGS = - 10 V  
1.2  
Qg (Max.) (nC)  
Qgs (nC)  
8.7  
2.2  
4.1  
Q
gd (nC)  
• 175 °C Operating Temperature  
• Fast Switching  
Configuration  
Single  
• Compliant to RoHS Directive 2002/95/EC  
S
D2PAK (TO-263)  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The D2PAK (TO-263) is a surface mount power package  
capable of accommodating die size up to HEX-4. It provides  
the highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK (TO-263) is suitable for high current applications  
because of its low internal connection resistance and can  
dissipate up to 2.0 W in a typical surface mount application.  
D
G
D
S
P-Channel MOSFET  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and Halogen-free  
D2PAK (TO-263)  
SiHF9510S-GE3  
IRF9510SPbF  
D2PAK (TO-263)  
SiHF9510STRL-GE3a  
IRF9510STRLPbFa  
SiHF9510STL-E3a  
Lead (Pb)-free  
SiHF9510S-E3  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
VDS  
LIMIT  
- 100  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
T
C = 25 °C  
- 4.0  
- 2.8  
- 16  
Continuous Drain Current  
V
GS at - 10 V  
ID  
TC = 100 °C  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.29  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Avalanche Currenta  
0.025  
200  
EAS  
IAR  
mJ  
A
- 4.0  
4.3  
Repetiitive Avalanche Energya  
EAR  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TC = 25 °C  
43  
PD  
W
V/ns  
°C  
TA = 25 °C  
3.7  
dV/dt  
- 5.5  
- 55 to + 175  
300d  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = - 25 V, starting TJ = 25 °C, L = 18 mH, Rg = 25 , IAS = - 4.0 A (see fig. 12).  
c. ISD - 4.0 A, dI/dt 75 A/μs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91073  
S11-1050-Rev. C, 30-May-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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