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IRF9510S, SiHF9510S PDF预览

IRF9510S, SiHF9510S

更新时间: 2024-11-22 14:55:51
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威世 - VISHAY /
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9页 196K
描述
Power MOSFET

IRF9510S, SiHF9510S 数据手册

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IRF9510S, SiHF9510S  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
S
• Surface-mount  
• Available in tape and reel  
D2PAK (TO-263)  
• Dynamic dV/dt rating  
• Repetitive avalanche rated  
• P-channel  
Available  
Available  
G
• 175 °C operating temperature  
• Fast switching  
D
G
• Material categorization: for definitions of compliance  
S
D
please see www.vishay.com/doc?99912  
P-Channel MOSFET  
Note  
*
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details  
PRODUCT SUMMARY  
VDS (V)  
-100  
DESCRIPTION  
RDS(on) (Ω)  
VGS = -10 V  
1.2  
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
Qg max. (nC)  
8.7  
2.2  
4.1  
Qgs (nC)  
gd (nC)  
Q
The D2PAK (TO-263) is a surface-mount power package  
capable of accommodating die size up to HEX-4. It provides  
the highest power capability and the lowest possible  
on-resistance in any existing surface-mount package. The  
D2PAK (TO-263) is suitable for high current applications  
because of its low internal connection resistance and can  
dissipate up to 2.0 W in a typical surface mount application.  
Configuration  
Single  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
SiHF9510S-GE3  
IRF9510SPbF  
D2PAK (TO-263)  
SiHF9510STRL-GE3 a  
IRF9510STRLPbF a  
-
Lead (Pb)-free and Halogen-free  
Lead (Pb)-free  
IRF9510STRRPbF  
Note  
a. See device orientation  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
-100  
20  
V
T
C = 25 °C  
-4.0  
Continuous Drain Current  
VGS at -10 V  
ID  
TC = 100 °C  
-2.8  
A
Pulsed Drain Current a  
IDM  
-16  
Linear Derating Factor  
0.29  
0.025  
200  
W/°C  
Linear Derating Factor (PCB mount) e  
Single Pulse Avalanche Energy b  
Avalanche Currenta  
EAS  
IAR  
mJ  
A
-4.0  
Repetiitive Avalanche Energy a  
EAR  
4.3  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB mount) e  
Peak Diode Recovery dV/dt c  
T
C = 25 °C  
43  
PD  
W
V/ns  
°C  
TA = 25 °C  
3.7  
dV/dt  
-5.5  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) d  
TJ, Tstg  
-55 to +175  
300  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = - 25 V, starting TJ = 25 °C, L = 18 mH, Rg = 25 Ω, IAS = - 4.0 A (see fig. 12)  
c. ISD - 4.0 A, dI/dt 75 A/μs, VDD VDS, TJ 175 °C  
d. 1.6 mm from case  
e. When mounted on 1" square PCB (FR-4 or G-10 material)  
S21-0904-Rev. D, 30-Aug-2021  
Document Number: 91073  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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