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IRF840STRRPBF PDF预览

IRF840STRRPBF

更新时间: 2024-11-02 05:39:27
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
8页 1040K
描述
Power MOSFET

IRF840STRRPBF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, R-PSSO-G2
针数:3Reach Compliance Code:compliant
Factory Lead Time:9 weeks风险等级:5
其他特性:AVALANCHE RATED雪崩能效等级(Eas):510 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):8 A
最大漏极电流 (ID):8 A最大漏源导通电阻:0.85 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):125 W
最大脉冲漏极电流 (IDM):32 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF840STRRPBF 数据手册

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IRF840S, SiHF840S  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• Surface Mount  
500  
• Available in Tape and Reel  
• Dynamic dV/dt Rating  
Available  
R
DS(on) (Ω)  
VGS = 10 V  
0.85  
RoHS*  
Qg (Max.) (nC)  
63  
9.3  
COMPLIANT  
• Repetitive Avalanche Rated  
• Fast Switching  
Q
Q
gs (nC)  
gd (nC)  
32  
• Ease of Paralleling  
Configuration  
Single  
• Simple Drive Requirement  
• Lead (Pb)-free Available  
D
D2PAK (TO-263)  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The SMD-220 is a surface mount power package capable of  
accommodating die size up to HEX-4. It provides the highest  
power capability and the lowest possible on-resistance in  
any existing surface mount package. The SMD-220 is  
suitable for high current applications because of its low  
internal connection resistance and can dissipate up to 2.0 W  
in a typical surface mount application.  
D
G
S
N-Channel MOSFET  
S
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
IRF840SPbF  
D2PAK (TO-263)  
IRF840STRLPbFa  
SiHF840STL-E3a  
IRF840STRaL  
D2PAK (TO-263)  
IRF840STRRPbFa  
SiHF840STR-E3a  
IRF840STRa  
Lead (Pb)-free  
SiHF840S-E3  
IRF840S  
SiHF840S  
SnPb  
SiHF840STLa  
SiHF840STRa  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
500  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
T
C = 25 °C  
8.0  
Continuous Drain Current  
V
GS at 10 V  
ID  
TC =100°C  
5.1  
A
Pulsed Drain Currenta  
IDM  
32  
Linear Derating Factor  
1.0  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Avalanche Currenta  
0.025  
510  
EAS  
IAR  
mJ  
A
8.0  
Repetiitive Avalanche Energya  
EAR  
13  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TC = 25 °C  
125  
PD  
W
V/ns  
°C  
TA = 25 °C  
3.1  
dV/dt  
3.5  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 14 mH, RG = 25 Ω, IAS = 8.0 A (see fig. 12).  
c. ISD 8.0 A, dI/dt 100 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91071  
S-81432-Rev. A, 07-Jul-08  
www.vishay.com  
1

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