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IRF7805TRPbF-1 PDF预览

IRF7805TRPbF-1

更新时间: 2024-02-02 16:53:37
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
6页 338K
描述
HEXFET® Chip-Set for DC-DC Converters

IRF7805TRPbF-1 数据手册

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IRF7805TRPbF-1  
HEXFET® Chip-Set for DC-DC Converters  
VDSS  
30  
V
RDS(on)  
(@ VGS =4.5V)  
11  
22  
13  
m  
nC  
A
Qg (typical)  
ID  
(@ TA = 25°C  
Features  
Benefits  
Industry-standard pinout SO-8 Package  
Compatible with Existing Surface Mount Techniques  
RoHS Compliant, Halogen-Free  
Multi-Vendor Compatibility  
Easier Manufacturing  
  
Environmentally Friendlier  
Increased Reliability  
MSL1, Industrial qualification  
Standard Pack  
Form  
Base part number  
Package Type  
Orderable Part Number  
Quantity  
Tape and Reel  
4000  
IRF7805TRPbF-1  
IRF7805PbF-1  
SO-8  
Symbol  
Parameter  
Max.  
Units  
VDS  
Drain-Source Voltage  
Gate-to-Source Voltage  
30  
± 12  
13  
V
VGS  
ID @ TA = 25°C  
Continuous Drain Current, VGS @ 10V  
A
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V   
Pulsed Drain Current   
10  
100  
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipation   
2.5  
W
W/°C  
°C  
Maximum Power Dissipation   
Linear Derating Factor  
1.6  
0.02  
TJ  
TSTG  
Operating Junction and  
Storage Temperature Range  
-55 to + 150  
Thermal Resistance  
Symbol  
Parameter  
Junction-to-Drain Lead  
Typ.  
–––  
–––  
Max.  
20  
Units  
RJL  
RJA  
°C/W  
Junction-to-Ambient   
50  
1
2016-08-23  

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