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IRF5803TRPBF PDF预览

IRF5803TRPBF

更新时间: 2024-01-14 03:39:10
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 207K
描述
HEXFETPower MOSFET

IRF5803TRPBF 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:15 weeks风险等级:1.7
配置:Single最大漏极电流 (Abs) (ID):3.4 A
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-609代码:e3
湿度敏感等级:2最高工作温度:150 °C
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):2 W子类别:Other Transistors
表面贴装:YES端子面层:Matte Tin (Sn)
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

IRF5803TRPBF 数据手册

 浏览型号IRF5803TRPBF的Datasheet PDF文件第2页浏览型号IRF5803TRPBF的Datasheet PDF文件第3页浏览型号IRF5803TRPBF的Datasheet PDF文件第4页浏览型号IRF5803TRPBF的Datasheet PDF文件第5页浏览型号IRF5803TRPBF的Datasheet PDF文件第6页浏览型号IRF5803TRPBF的Datasheet PDF文件第7页 
PD-95262B  
IRF5803PbF  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l P-Channel MOSFET  
l Surface Mount  
l Available in Tape & Reel  
l Low Gate Charge  
l Lead-Free  
VDSS  
-40V  
RDS(on) max (mW)  
112@VGS = -10V  
ID  
-3.4A  
190@VGS = -4.5V  
-2.7A  
l Halogen-Free  
A
1
2
6
D
D
D
Description  
These P-channel HEXFET® Power MOSFETs from  
International Rectifier utilize advanced processing  
techniquestoachievetheextremelylowon-resistance  
per silicon area. This benefit provides the designer  
withanextremelyefficientdeviceforuseinbatteryand  
load management applications.  
5
D
3
4
G
S
TSOP-6  
Top View  
The TSOP-6 package with its customized leadframe  
produces a HEXFET® power MOSFET with RDS(on)  
60% less than a similar size SOT-23. This package is  
idealforapplicationswhereprintedcircuitboardspace  
isatapremium. It'suniquethermaldesignandRDS(on)  
reductionenablesacurrent-handlingincreaseofnearly  
300% compared to the SOT-23.  
Absolute Maximum Ratings  
Parameter  
Drain- Source Voltage  
Max.  
-40  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current   
-3.4  
-2.7  
A
-27  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation ƒ  
Power Dissipation ƒ  
2.0  
W
1.3  
Linear Derating Factor  
16  
mW/°C  
VGS  
Gate-to-Source Voltage  
± 20  
V
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambientƒ  
Max.  
62.5  
Units  
°C/W  
RθJA  
www.irf.com  
1
04/20/10  

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