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IRF5810TRPBF PDF预览

IRF5810TRPBF

更新时间: 2024-01-19 03:01:39
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 204K
描述
Ultra Low On-Resistance

IRF5810TRPBF 数据手册

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PD - 95469B  
IRF5810PbF  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l Dual P-Channel MOSFET  
l Surface Mount  
l Available in Tape & Reel  
l Low Gate Charge  
l Lead-Free  
VDSS  
-20V  
RDS(on) max (mW)  
90@VGS = -4.5V  
ID  
-2.9A  
135@VGS = -2.5V  
-2.3A  
l Halogen-Free  
Description  
These P-channel HEXFET® Power MOSFETs from  
International Rectifier utilize advanced processing  
techniquestoachievetheextremelylowon-resistance  
per silicon area. This benefit provides the designer  
withanextremelyefficientdeviceforuseinbatteryand  
load management applications.  
TSOP-6  
This Dual TSOP-6 package is ideal for applications  
where printed circuit board space is at a premium and  
where maximum functionality is required. With two  
die per package, the IRF5810 can provide the  
functionality of two SOT-23 packages in a smaller  
footprint. Its unique thermal design and RDS(on)  
reduction enables an increase in current-handling  
capability.  
Absolute Maximum Ratings  
Parameter  
Drain- Source Voltage  
Max.  
-20  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current   
-2.9  
-2.3  
A
-11  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation ƒ  
Power Dissipation ƒ  
0.96  
W
0.62  
Linear Derating Factor  
0.008  
± 12  
mW/°C  
VGS  
Gate-to-Source Voltage  
V
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambientƒ  
Max.  
130  
Units  
°C/W  
RθJA  
www.irf.com  
1
04/20/10  

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