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IRF3711ZCSPBF PDF预览

IRF3711ZCSPBF

更新时间: 2024-11-25 04:23:15
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
12页 354K
描述
HEXFET Power MOSFET

IRF3711ZCSPBF 数据手册

 浏览型号IRF3711ZCSPBF的Datasheet PDF文件第2页浏览型号IRF3711ZCSPBF的Datasheet PDF文件第3页浏览型号IRF3711ZCSPBF的Datasheet PDF文件第4页浏览型号IRF3711ZCSPBF的Datasheet PDF文件第5页浏览型号IRF3711ZCSPBF的Datasheet PDF文件第6页浏览型号IRF3711ZCSPBF的Datasheet PDF文件第7页 
PD-95110  
IRF3711ZCSPbF  
IRF3711ZCLPbF  
HEXFET® Power MOSFET  
Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
l Lead-Free  
VDSS RDS(on) max  
Qg  
6.0m:  
20V  
16nC  
Benefits  
l Low RDS(on) at 4.5V VGS  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
D2Pak  
TO-262  
IRF3711ZCSPbF  
IRF3711ZCLPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
20  
Units  
V
VDS  
Drain-to-Source Voltage  
V
Gate-to-Source Voltage  
± 20  
92  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
@ TC = 25°C  
A
D
D
65  
@ TC = 100°C  
380  
79  
DM  
P
P
@TC = 25°C  
Maximum Power Dissipation  
Maximum Power Dissipation  
W
D
D
@TC = 100°C  
40  
Linear Derating Factor  
Operating Junction and  
0.53  
-55 to + 175  
W/°C  
°C  
T
J
T
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.89  
40  
Units  
°C/W  
RθJC  
Junction-to-Case  
RθJA  
–––  
Junction-to-Ambient (PCB Mount)  
Notes  through are on page 11  
www.irf.com  
1
03/11/04  

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