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IRF3709Z PDF预览

IRF3709Z

更新时间: 2024-11-25 04:23:15
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
12页 334K
描述
HEXFET Power MOSFET

IRF3709Z 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:TO-220AB, 3 PINReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.14
Is Samacsys:N雪崩能效等级(Eas):60 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):42 A
最大漏源导通电阻:0.0063 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):350 A认证状态:Not Qualified
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF3709Z 数据手册

 浏览型号IRF3709Z的Datasheet PDF文件第2页浏览型号IRF3709Z的Datasheet PDF文件第3页浏览型号IRF3709Z的Datasheet PDF文件第4页浏览型号IRF3709Z的Datasheet PDF文件第5页浏览型号IRF3709Z的Datasheet PDF文件第6页浏览型号IRF3709Z的Datasheet PDF文件第7页 
PD - 95835  
IRF3709Z  
IRF3709ZS  
IRF3709ZL  
HEXFET® Power MOSFET  
Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
VDSS RDS(on) max  
Qg  
6.3m:  
30V  
17nC  
Benefits  
l Low RDS(on) at 4.5V VGS  
l Low Gate Charge  
l Fully Characterized Avalanche Voltage  
and Current  
D2Pak  
IRF3709ZS  
TO-262  
IRF3709ZL  
TO-220AB  
IRF3709Z  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
Drain-to-Source Voltage  
30  
± 20  
87  
V
V
Gate-to-Source Voltage  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
@ TC = 25°C  
A
D
D
62  
@ TC = 100°C  
350  
79  
DM  
P
P
@TC = 25°C  
Maximum Power Dissipation  
Maximum Power Dissipation  
W
D
D
@TC = 100°C  
40  
Linear Derating Factor  
Operating Junction and  
0.53  
W/°C  
°C  
T
-55 to + 175  
J
T
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
300 (1.6mm from case)  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.89  
40  
Units  
°C/W  
RθJC  
Junction-to-Case  
RθJA  
–––  
Junction-to-Ambient (PCB Mount)  
Notes  through ‡ are on page 12  
www.irf.com  
1
1/16/04  

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