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IRF1902 PDF预览

IRF1902

更新时间: 2024-11-23 22:31:19
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 109K
描述
Power MOSFET(Vdss=20V)

IRF1902 数据手册

 浏览型号IRF1902的Datasheet PDF文件第2页浏览型号IRF1902的Datasheet PDF文件第3页浏览型号IRF1902的Datasheet PDF文件第4页浏览型号IRF1902的Datasheet PDF文件第5页浏览型号IRF1902的Datasheet PDF文件第6页浏览型号IRF1902的Datasheet PDF文件第7页 
PD - 94282A  
IRF1902  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l N-Channel MOSFET  
l Surface Mount  
VDSS  
20V  
RDS(on) max (mΩ)  
85@VGS = 4.5V  
ID  
4.0A  
170@VGS = 2.7V  
3.2A  
l Available in Tape & Reel  
A
A
D
1
2
Description  
8
S
S
These N-Channel HEXFET power MOSFETs from  
International Rectifier utilize advanced processing  
techniquestoachievetheextremelylowon-resistance  
per silicon area. This benefit provides the designer  
with an extremely efficient device for use in battery  
and load management applications..  
7
D
3
4
6
S
D
5
G
D
SO-8  
Top V iew  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of  
powerapplications. Withtheseimprovements,multiple  
devicescanbeusedinanapplicationwithdramatically  
reduced board space. The package is designed for  
vapor phase, infrared, or wave soldering techniques.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
Drain- Source Voltage  
20  
V
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ 4.5V  
Continuous Drain Current, VGS @ 4.5V  
Pulsed Drain Current   
4.2  
3.4  
A
17  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation ƒ  
2.5  
W
Power Dissipationƒ  
1.6  
Linear Derating Factor  
0.02  
mW/°C  
VGS  
Gate-to-Source Voltage  
± 12  
V
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Symbol  
RθJL  
Parameter  
Junction-to-Drain Lead  
Typ.  
–––  
Max.  
20  
Units  
RθJA  
Junction-to-Ambient ƒ  
–––  
50  
°C/W  
www.irf.com  
1
11/15/01  

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