Datasheet > IRF1404

IRF1404

更新时间： 2024-11-05 12:34:51

品牌	Logo	应用领域
科盛美 - KERSEMI		/
页数	文件大小	规格书
8页	2992K
描述
Advanced Process Technology Ultra Low On-Resistance

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IRF1404 数据手册

IRF1404

^lAdvanced Process Technology

^lUltra Low On-Resistance

^lDynamic dv/dt Rating

^l175°C Operating Temperature

^lFast Switching

V_DSS= 40V

R_DS(on)= 0.004Ω

I_D= 162A

^lFully Avalanche Rated

Description

Seventh Generation HEXFET^®Power MOSFETs from

International Rectifier utilize advanced processing

techniques to achieve extremely low on-resistance per

silicon area. This benefit, combined with the fast

switching speed and ruggedized device design that

HEXFET power MOSFETs are well known for, provides

the designer with an extremely efficient and reliable

device for use in a wide variety of applications.

The TO-220 package is universally preferred for all

commercial-industrial applications at power dissipation

levels to approximately 50 watts. The low thermal

resistance and low package cost of the TO-220

contributetoitswideacceptancethroughouttheindustry.

TO-220AB

Absolute Maximum Ratings

Parameter

Max.

Units

I_D@ T_C= 25°C

I_D@ T_C= 100°C

I_DM

Continuous Drain Current, V_GS@ 10V

Pulsed Drain Current

162

115

650

P_D@T_C= 25°C

Power Dissipation

200

W/°C

Linear Derating Factor

1.3

V_GS

E_AS

I_AR

Gate-to-Source Voltage

± 20

Single Pulse Avalanche Energy

Avalanche Current

519

E_AR

dv/dt

T_J

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt

Operating Junction and

V/ns

5.0

-55 to + 175

300 (1.6mm from case )

10 lbf•in (1.1N•m)

T_STG

Storage Temperature Range

Soldering Temperature, for 10 seconds

Mounting Torque, 6-32 or M3 screw

°C

Thermal Resistance

Parameter

Junction-to-Case

Typ.

–––

Max.

Units

R_θJC

R_θCS

R_θJA

0.75

–––

Case-to-Sink, Flat, Greased Surface

Junction-to-Ambient

0.50

–––

°C/W

www.kersemi.com

10/20/00

12 3 4 5 6 7 8

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