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IRF1404S PDF预览

IRF1404S

更新时间: 2024-02-15 12:55:09
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 306K
描述
Power MOSFET(Vdss=40V, Rds(on)=0.004ohm, Id=162A)

IRF1404S 数据手册

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PD-93853C  
IRF1404S  
IRF1404L  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
D
VDSS = 40V  
l 175°C Operating Temperature  
l Fast Switching  
l Fully Avalanche Rated  
RDS(on) = 0.004Ω  
G
ID = 162A†  
Description  
Seventh Generation HEXFET® Power MOSFETs from  
S
International Rectifier utilize advanced processing  
techniques to achieve extremely low on-resistance per  
silicon area. This benefit, combined with the fast  
switching speed and ruggedized device design that  
HEXFET power MOSFETs are well known for, provides  
the designer with an extremely efficient and reliable  
device for use in a wide variety of applications.  
The D2Pak is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible on-  
resistance in any existing surface mount package. The  
D2Pak is suitable for high current applications because of  
its low internal connection resistance and can dissipate up  
to 2.0W in a typical surface mount application.  
The through-hole version (IRF1404L) is available for low-  
profile applications.  
D2Pak  
IRF1404S  
TO-262  
IRF1404L  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V‡  
Continuous Drain Current, VGS @ 10V‡  
Pulsed Drain Current ‡  
162†  
115†  
650  
3.8  
A
PD @TA = 25°C  
PD @TC = 25°C  
Power Dissipation  
W
W
Power Dissipation  
200  
1.3  
Linear Derating Factor  
W/°C  
V
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
519  
95  
Single Pulse Avalanche Energy‡  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ‡  
Operating Junction and  
20  
mJ  
V/ns  
5.0  
-55 to +175  
-55 to +175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.75  
40  
Units  
°C/W  
RθJC  
RθJA  
Junction-to-Case  
Junction-to-Ambient (PCB mounted, steady-state)*  
–––  
www.irf.com  
1
5/18/01  

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