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IPB35N10S3L-26_15 PDF预览

IPB35N10S3L-26_15

更新时间： 2024-10-31 01:18:03
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
1页 33K
描述
Material Content Data Sheet

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中文翻译

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IPB35N10S3L-26_15 数据手册

  
Material Content Data Sheet  
Sales Product Name IPB35N10S3L-26  
Issued  
21. September 2015  
MA#  
MA001383674  
PG-TO263-3-2  
Package  
Weight*  
1558.59 mg  
Average  
Mass  
[%]  
Average  
CAS#  
Weight  
[mg]  
Sum  
[%]  
Sum  
Construction Element  
Material Group  
Substances  
Mass  
[ppm]  
if applicable  
[ppm]  
chip  
inorganic material  
non noble metal  
inorganic material  
non noble metal  
non noble metal  
organic material  
plastics  
silicon  
7440-21-3  
7439-89-6  
7723-14-0  
7440-50-8  
7429-90-5  
1333-86-4  
-
3.025  
0.304  
0.19  
0.02  
0.01  
19.51  
0.18  
0.66  
7.27  
36.14  
0.63  
0.01  
0.00  
0.00  
0.00  
0.19  
0.04  
0.01  
35.14  
0.19  
1941  
195  
1941  
leadframe  
iron  
phosphorus  
copper  
0.091  
59  
304.026  
2.836  
19.54  
0.18  
195065  
1819  
6610  
72709  
361342  
6273  
147  
195319  
1819  
wire  
aluminium  
carbon black  
epoxy resin  
silicondioxide  
tin  
encapsulation  
10.302  
113.324  
563.184  
9.777  
inorganic material  
non noble metal  
non noble metal  
inorganic material  
noble metal  
60676-86-0  
7440-31-5  
7440-02-0  
7723-14-0  
7440-22-4  
7440-31-5  
7439-92-1  
7439-89-6  
7723-14-0  
7440-50-8  
44.07  
0.63  
440662  
6273  
leadfinish  
plating  
nickel  
0.228  
phosphorus  
silver  
0.001  
0.01  
0.19  
1
147  
solder  
0.078  
50  
non noble metal  
non noble metal  
non noble metal  
inorganic material  
non noble metal  
< 10%  
tin  
0.062  
40  
lead  
2.970  
1905  
352  
1995  
heatspreader  
*deviation  
iron  
0.548  
phosphorus  
copper  
0.165  
106  
547.666  
35.19  
351386  
351844  
Sum in total: 100.00  
1000000  
Important Remarks:  
1.  
2.  
3.  
Infineon Technologies AG provides full material declaration based on information provided by third parties and  
has taken and continues to take reasonable steps to provide representative and accurate information.  
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be  
proprietary, and thus CAS numbers and other limited information may not be available for release.  
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any  
time due to technical requirements and development without notification.  
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption  
7a, Lead in high melting temperature type solders.  
Company  
Address  
Internet  
Infineon Technologies AG  
81726 München  
www.infineon.com  
1

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