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HN58C256AT-10E PDF预览

HN58C256AT-10E

更新时间: 2024-02-01 13:54:43
品牌 Logo 应用领域
瑞萨 - RENESAS 可编程只读存储器电动程控只读存储器电可擦编程只读存储器光电二极管内存集成电路
页数 文件大小 规格书
25页 241K
描述
32KX8 EEPROM 5V, 100ns, PDSO28, LEAD FREE, PLASTIC, TSOP-28

HN58C256AT-10E 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TSOP
包装说明:TSSOP, TSSOP28,.53,22针数:28
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.58
最长访问时间:100 ns命令用户界面:NO
数据轮询:YES耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PDSO-G28长度:11.8 mm
内存密度:262144 bit内存集成电路类型:EEPROM
内存宽度:8湿度敏感等级:3
功能数量:1端子数量:28
字数:32768 words字数代码:32000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:32KX8
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP28,.53,22封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH页面大小:64 words
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V编程电压:5 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.00002 A子类别:EEPROMs
最大压摆率:0.03 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:YES
宽度:8 mm最长写入周期时间 (tWC):10 ms
Base Number Matches:1

HN58C256AT-10E 数据手册

 浏览型号HN58C256AT-10E的Datasheet PDF文件第4页浏览型号HN58C256AT-10E的Datasheet PDF文件第5页浏览型号HN58C256AT-10E的Datasheet PDF文件第6页浏览型号HN58C256AT-10E的Datasheet PDF文件第8页浏览型号HN58C256AT-10E的Datasheet PDF文件第9页浏览型号HN58C256AT-10E的Datasheet PDF文件第10页 
HN58C256A Series, HN58C257A Series  
Write Cycle  
Parameter  
Symbol Min*3 Typ  
Max  
Unit Test conditions  
Address setup time  
tAS  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
µs  
µs  
ms  
ns  
ns  
µs  
µs  
Address hold time  
tAH  
50  
0
CE to write setup time (WE controlled)  
CE hold time (WE controlled)  
WE to write setup time (CE controlled)  
WE hold time (CE controlled)  
OE to write setup time  
OE hold time  
tCS  
tCH  
tWS  
tWH  
tOES  
tOEH  
tDS  
0
0
0
0
0
Data setup time  
50  
0
Data hold time  
tDH  
tWP  
tCW  
tDL  
WE pulse width (WE controlled)  
CE pulse width (CE controlled)  
Data latch time  
100  
100  
50  
0.2  
100  
Byte load cycle  
tBLC  
tBL  
tWC  
tDB  
tDW  
tRP  
30  
Byte load window  
10*4  
Write cycle time  
Time to device busy  
120  
0*5  
100  
1
Write start time  
Reset protect time*2  
Reset high time*2, 6  
tRES  
Notes: 1. tDF and tDFR are defined as the time at which the outputs achieve the open circuit conditions and are  
no longer driven.  
2. This function is supported by only the HN58C257A series.  
3. Use this device in longer cycle than this value.  
4. tWC must be longer than this value unless polling techniques or RDY/Busy (only the HN58C257A  
series) are used. This device automatically completes the internal write operation within this value.  
5. Next read or write operation can be initiated after tDW if polling techniques or RDY/Busy (only the  
HN58C257A series) are used.  
6. This parameter is sampled and not 100% tested.  
7. A6 through A14 are page address and these addresses are latched at the first falling edge of WE.  
8. A6 through A14 are page address and these addresses are latched at the first falling edge of CE.  
9. See AC read characteristics.  
Rev.5.00, Nov. 17.2003, page 7 of 23  

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