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GT8G103(2-7B6C) PDF预览

GT8G103(2-7B6C)

更新时间: 2024-11-20 21:09:51
品牌 Logo 应用领域
东芝 - TOSHIBA 双极性晶体管
页数 文件大小 规格书
5页 364K
描述
TRANSISTOR 8 A, 400 V, N-CHANNEL IGBT, 2-7B6C, 3 PIN, Insulated Gate BIP Transistor

GT8G103(2-7B6C) 技术参数

生命周期:Active包装说明:SMALL OUTLINE, R-PSSO-G2
针数:3Reach Compliance Code:unknown
HTS代码:8541.29.00.95风险等级:5.64
其他特性:LOW SATURATION VOLTAGE外壳连接:COLLECTOR
最大集电极电流 (IC):8 A集电极-发射极最大电压:400 V
配置:SINGLE WITH BUILT-IN DIODEJESD-30 代码:R-PSSO-G2
元件数量:1端子数量:2
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE晶体管元件材料:SILICON
标称断开时间 (toff):2400 ns标称接通时间 (ton):1400 ns
Base Number Matches:1

GT8G103(2-7B6C) 数据手册

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GT8G103  
TOSHIBA INSULATED GATE BIPOLAR TRANSISTOR SILICON N CHANNEL IGBT  
GT8G103  
STROBE FLASH APPLICATIONS  
Unit: mm  
z
z
z
z
3rd Generation  
(A)  
EnhancementMode  
Low Saturation Voltage: V  
4.5 V Gate Drive  
= 8 V (Max.) (@I = 150 A)  
CE (sat)  
C
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)  
CHARACTERISTIC  
SYMBOL  
RATING  
UNIT  
CollectorEmitter Voltage  
V
V
V
400  
±6  
V
V
CES  
GES  
GES  
(B)  
DC  
GateEmitter Voltage  
Pulse  
DC  
±8  
V
I
8
A
C
Collector Current  
1 ms  
I
150  
1.3  
A
CP  
Ta = 25°C  
Tc = 25°C  
P
W
W
°C  
°C  
Collector Power  
Dissipation  
C
C
P
20  
Junction Temperature  
T
j
150  
55~150  
Storage Temperature Range  
T
stg  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e. operating  
temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
JEDEC  
JEITA  
TOSHIBA (A) 2-7B5C (B) 2-7B6C  
Weight: 0.36 g (typ.)  
Please design the appropriate reliability upon reviewing the Toshiba  
Semiconductor Reliability Handbook (“Handling  
Precautions”/Derating Concept and Methods) and individual reliability  
data (i.e. reliability test report and estimated failure rate, etc).  
ELECTRICAL CHARACTERISTICS (Ta = 25°C)  
CHARACTERISTIC  
Gate Leakage Current  
SYMBOL  
TEST CONDITION  
= 6 V, V = 0  
MIN  
TYP.  
MAX  
UNIT  
I
V
V
0.5  
10  
10  
1.2  
8
µA  
µA  
V
GES  
GE  
CE  
Collector Cutoff Current  
GateEmitter Cutoff Voltage  
CollectorEmitter Saturation Voltage  
Input Capacitance  
I
= 400 V, V  
= 0  
CES  
CE  
GE  
V
I
C
I
C
= 1 mA, V = 5 V  
GE (OFF)  
CE  
V
= 150 A, V  
= 4.5 V (Pulsed)  
5
V
CE (sat)  
GE  
C
ies  
V
CE  
= 10 V, V = 0, f = 1 MHz  
GE  
1900  
1.2  
1.4  
1.8  
2.4  
pF  
Rise Time  
t
r
Turnon Time  
Switching Time  
t
on  
µs  
Fall Time  
t
f
Turnoff Time  
t
off  
Thermal Resistance  
R
th (jc)  
6.25 °C / W  
These devices are MOS type. Users should follow proper ESD Handling Procedures.  
Operating condition of turn-off dv / dt should be lower than 400 V / µs.  
1
2006-11-02  

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